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MBM29LV160BM90PBT-E1 PDF预览

MBM29LV160BM90PBT-E1

更新时间: 2024-11-06 15:42:31
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路
页数 文件大小 规格书
64页 409K
描述
Flash, 1MX16, 90ns, PBGA48, PLASTIC, FBGA-48

MBM29LV160BM90PBT-E1 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:PLASTIC, FBGA-48针数:48
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.31
Is Samacsys:N最长访问时间:90 ns
备用内存宽度:8启动块:BOTTOM
JESD-30 代码:R-PBGA-B48长度:8 mm
内存密度:16777216 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
端子数量:48字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:-20 °C
组织:1MX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):240编程电压:3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
类型:NOR TYPE宽度:6 mm
Base Number Matches:1

MBM29LV160BM90PBT-E1 数据手册

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MBM29LV160TM/BM 90  
Data Sheet (Retired Product)  
MBM29LV160TM/BM 90Cover Sheet  
This product has been retired and is not recommended for new designs. Availability of this document is retained for reference  
and historical purposes only.  
Continuity of Specifications  
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been  
made are the result of normal data sheet improvement and are noted in the document revision summary.  
For More Information  
Please contact your local sales office for additional information about Spansion memory solutions.  
Publication Number MBM29LV160TM/BM  
Revision DS05-20906-4E  
Issue Date July 31, 2007  

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