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MBM29LV160BM90TN PDF预览

MBM29LV160BM90TN

更新时间: 2024-12-01 05:22:27
品牌 Logo 应用领域
飞索 - SPANSION 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
57页 521K
描述
FLASH MEMORY CMOS 16 M (2M X 8/1M X 16) BIT MirrorFlashTM

MBM29LV160BM90TN 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP1包装说明:PLASTIC, TSOP1-48
针数:48Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.63最长访问时间:90 ns
备用内存宽度:8启动块:BOTTOM
命令用户界面:YES通用闪存接口:YES
数据轮询:YESJESD-30 代码:R-PDSO-G48
JESD-609代码:e0长度:18.4 mm
内存密度:16777216 bit内存集成电路类型:FLASH
内存宽度:16湿度敏感等级:3
功能数量:1部门数/规模:1,2,1,31
端子数量:48字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:-20 °C
组织:1MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP48,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):240
电源:3.3 V编程电压:3 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.2 mm部门规模:16K,8K,32K,64K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.06 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
切换位:YES类型:NOR TYPE
宽度:12 mmBase Number Matches:1

MBM29LV160BM90TN 数据手册

 浏览型号MBM29LV160BM90TN的Datasheet PDF文件第2页浏览型号MBM29LV160BM90TN的Datasheet PDF文件第3页浏览型号MBM29LV160BM90TN的Datasheet PDF文件第4页浏览型号MBM29LV160BM90TN的Datasheet PDF文件第5页浏览型号MBM29LV160BM90TN的Datasheet PDF文件第6页浏览型号MBM29LV160BM90TN的Datasheet PDF文件第7页 
FUJITSU SEMICONDUCTOR  
DATA SHEET  
DS05-20906-3E  
FLASH MEMORY  
CMOS  
16 M (2M × 8/1M × 16) BIT  
MirrorFlashTM*  
MBM29LV160TM/BM 90  
DESCRIPTION  
The MBM29LV160TM/BM is a 32M-bit, 3.0 V-only Flash memory organized as 4M bytes by 8 bits or 2M words  
by 16 bits. The MBM29LV160TM/BM is offered in 48-pin TSOP(1) and 48-ball FBGA. The device is designed to  
be programmed in-system with the standard 3.0 V VCC supply. 12.0 V VPP and 5.0 V VCC are not required for  
program or erase operations. The devices can also be reprogrammed in standard EPROM programmers.  
The standard MBM29LV160TM/BM offers access times of 90 ns, allowing operation of high-speed microproces-  
sors without wait states. To eliminate bus contention the devices have separate chip enable (CE), write enable  
(WE), and output enable (OE) controls.  
(Continued)  
PRODUCT LINE UP  
MBM29LV160TM/BM  
Part No.  
90  
VCC  
3.0 V to 3.6 V  
90 ns  
Max Address Access Time  
Max CE Access Time  
Max OE Access Time  
90 ns  
25 ns  
PACKAGES  
48-pin plastic TSOP (1)  
48-ball plastic FBGA  
Marking Side  
(FPT-48P-M19)  
(BGA-48P-M20)  
* : MirrorFlashTM is a trademark of Fujitsu Limited.  
Notes : Programming in byte mode ( × 8) is prohibited.  
Programming to the address that already contains data is prohibited (It is mandatory to erase data prior to  
overprogram on the same address) .  

与MBM29LV160BM90TN相关器件

型号 品牌 获取价格 描述 数据表
MBM29LV160BM90TN-E1 SPANSION

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Flash, 1MX16, 90ns, PDSO48, PLASTIC, TSOP1-48
MBM29LV160T SPANSION

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FLASH MEMORY CMOS 16M (2M x 8/1M x 16) BIT
MBM29LV160T FUJITSU

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16M (2M xⅴ 8/1M x 16) BIT
MBM29LV160T-12 SPANSION

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FLASH MEMORY CMOS 16M (2M x 8/1M x 16) BIT
MBM29LV160T-12 FUJITSU

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16M (2M xⅴ 8/1M x 16) BIT
MBM29LV160T-12PBT SPANSION

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FLASH MEMORY CMOS 16M (2M x 8/1M x 16) BIT
MBM29LV160T-12PBT FUJITSU

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16M (2M xⅴ 8/1M x 16) BIT
MBM29LV160T-12PBT-E1 SPANSION

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Flash, 1MX16, 120ns, PBGA48, PLASTIC, FBGA-48
MBM29LV160T-12PBT-SF2 FUJITSU

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16M (2M xⅴ 8/1M x 16) BIT
MBM29LV160T-12PBT-SF2-E1 SPANSION

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Flash, 1MX16, 120ns, PBGA48, PLASTIC, FBGA-48