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MBM29LV160T-12PBT-SF2 PDF预览

MBM29LV160T-12PBT-SF2

更新时间: 2024-11-30 22:19:23
品牌 Logo 应用领域
富士通 - FUJITSU 闪存存储内存集成电路
页数 文件大小 规格书
60页 732K
描述
16M (2M xⅴ 8/1M x 16) BIT

MBM29LV160T-12PBT-SF2 技术参数

是否Rohs认证:不符合生命周期:Transferred
包装说明:PLASTIC, FBGA-48Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.77Is Samacsys:N
最长访问时间:120 ns其他特性:CONFIGURABLE AS 1M X 16
备用内存宽度:8启动块:TOP
命令用户界面:YES通用闪存接口:YES
数据轮询:YESJESD-30 代码:R-PBGA-B48
JESD-609代码:e0长度:9 mm
内存密度:16777216 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:1,2,1,31端子数量:48
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:1MX16
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA48,6X8,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
电源:3/3.3 V编程电压:3 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.2 mm部门规模:16K,8K,32K,64K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.035 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM切换位:YES
类型:NOR TYPE宽度:8 mm
Base Number Matches:1

MBM29LV160T-12PBT-SF2 数据手册

 浏览型号MBM29LV160T-12PBT-SF2的Datasheet PDF文件第2页浏览型号MBM29LV160T-12PBT-SF2的Datasheet PDF文件第3页浏览型号MBM29LV160T-12PBT-SF2的Datasheet PDF文件第4页浏览型号MBM29LV160T-12PBT-SF2的Datasheet PDF文件第5页浏览型号MBM29LV160T-12PBT-SF2的Datasheet PDF文件第6页浏览型号MBM29LV160T-12PBT-SF2的Datasheet PDF文件第7页 
FUJITSU SEMICONDUCTOR  
DATA SHEET  
DS05-20846-4E  
FLASH MEMORY  
CMOS  
16M (2M × 8/1M × 16) BIT  
-80/-90/-12  
-80/-90/-12  
/MBM29LV160B  
MBM29LV160T  
FEATURES  
• Single 3.0 V read, program and erase  
Minimizes system level power requirements  
• Compatible with JEDEC-standard commands  
Uses same software commands as E2PROMs  
• Compatible with JEDEC-standard world-wide pinouts  
48-pin TSOP (I) (Package suffix: PFTN-Normal Bend Type, PFTR-Reversed Bend Type)  
46-pin SON (Package suffix: PN)  
48-pin CSOP (Package suffix: PCV)  
48-ball FBGA (Package suffix: PBT)  
• Minimum 100,000 program/erase cycles  
• High performance  
80 ns maximum access time  
• Sector erase architecture  
One 8K word, two 4K words, one 16K word, and thirty-one 32K words sectors in word mode  
One 16K byte, two 8K bytes, one 32K byte, and thirty-one 64K bytes sectors in byte mode  
Any combination of sectors can be concurrently erased. Also supports full chip erase  
• Boot Code Sector Architecture  
T = Top sector  
B = Bottom sector  
• Embedded EraseTM Algorithms  
Automatically pre-programs and erases the chip or any sector  
• Embedded programTM Algorithms  
Automatically programs and verifies data at specified address  
• Data Polling and Toggle Bit feature for detection of program or erase cycle completion  
• Ready/Busy output (RY/BY)  
Hardware method for detection of program or erase cycle completion  
• Automatic sleep mode  
When addresses remain stable, automatically switches themselves to low power mode  
• Low VCC write inhibit 2.5 V  
(Continued)  
Embedded EraseTM and Embedded ProgramTM are trademarks of Advanced Micro Devices, Inc.  

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暂无描述
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FLASH MEMORY CMOS 16M (2M x 8/1M x 16) BIT