是否Rohs认证: | 不符合 | 生命周期: | Contact Manufacturer |
包装说明: | LFBGA, BGA107,10X12,32 | Reach Compliance Code: | compliant |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.28 |
最长访问时间: | 70 ns | 其他特性: | MOBILE FCRAM IS ORGANISED AS 2M X 16; SRAM IS ORGANISED AS 512K X 16 |
JESD-30 代码: | R-PBGA-B107 | JESD-609代码: | e0 |
长度: | 10 mm | 内存密度: | 67108864 bit |
内存集成电路类型: | MEMORY CIRCUIT | 内存宽度: | 16 |
混合内存类型: | FLASH+SRAM | 功能数量: | 1 |
端子数量: | 107 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -30 °C |
组织: | 4MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装等效代码: | BGA107,10X12,32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 3 V |
认证状态: | Not Qualified | 座面最大高度: | 1.4 mm |
最大待机电流: | 0.0001 A | 子类别: | Other Memory ICs |
最大压摆率: | 0.05 mA | 最大供电电压 (Vsup): | 3.1 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 9 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MB84VZ064D-70PBS-E1 | SPANSION |
获取价格 |
Memory Circuit, 4MX16, CMOS, PBGA107, PLASTIC, FBGA-107 | |
MB84VZ064G-70PBS | FUJITSU |
获取价格 |
Memory Circuit, Flash+SRAM, 4MX16, CMOS, PBGA107, PLASTIC, FBGA-107 | |
MB84VZ128A | FUJITSU |
获取价格 |
Memory IC | |
MB84VZ128B-70PBS | SPANSION |
获取价格 |
Memory Circuit, 8MX16, CMOS, PBGA115, PLASTIC, FBGA-115 | |
MB84VZ128B-70PBS-E1 | SPANSION |
获取价格 |
Memory Circuit, 8MX16, CMOS, PBGA115, PLASTIC, FBGA-115 | |
MB84VZ128C-70PBS | SPANSION |
获取价格 |
Memory Circuit, 8MX16, CMOS, PBGA115, PLASTIC, FBGA-115 | |
MB84VZ128C-70PBS | FUJITSU |
获取价格 |
Memory Circuit, Flash+PSRAM+SRAM, Hybrid, PBGA115 | |
MB84VZ128C-70PBS-E1 | SPANSION |
获取价格 |
Memory Circuit, 8MX16, CMOS, PBGA115, PLASTIC, FBGA-115 | |
MB8501E064AD-60DG | FUJITSU |
获取价格 |
EDO DRAM Module, 1MX64, 60ns, CMOS, PDMA168 | |
MB8501E064AD-70DG | FUJITSU |
获取价格 |
EDO DRAM Module, 1MX64, 70ns, CMOS, PDMA168 |