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LSM6DS33TR PDF预览

LSM6DS33TR

更新时间: 2024-11-23 01:16:27
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意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
77页 1133K
描述
iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

LSM6DS33TR 技术参数

生命周期:Active包装说明:VFLGA,
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.36
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:S-PBGA-B16
JESD-609代码:e4长度:3 mm
湿度敏感等级:3功能数量:1
端子数量:16最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:VFLGA封装形状:SQUARE
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
座面最大高度:0.86 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):1.71 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Gold (Ni/Au) - electrolytic
端子形式:BUTT端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3 mmBase Number Matches:1

LSM6DS33TR 数据手册

 浏览型号LSM6DS33TR的Datasheet PDF文件第2页浏览型号LSM6DS33TR的Datasheet PDF文件第3页浏览型号LSM6DS33TR的Datasheet PDF文件第4页浏览型号LSM6DS33TR的Datasheet PDF文件第5页浏览型号LSM6DS33TR的Datasheet PDF文件第6页浏览型号LSM6DS33TR的Datasheet PDF文件第7页 
LSM6DS33  
iNEMO inertial module:  
always-on 3D accelerometer and 3D gyroscope  
Datasheet - production data  
Description  
The LSM6DS33 is a system-in-package featuring a 3D  
digital accelerometer and a 3D digital gyroscope  
performing at 1.25 mA (up to 1.6 kHz ODR) in high-  
performance mode and enabling always-on low-power  
features for an optimal motion experience for the  
LGA-16L (3 x 3 x 0.86 mm) typ.  
consumer.  
The LSM6DS33 supports main OS requirements,  
offering real, virtual and batch sensors with 8 kbyte for  
dynamic data batching.  
Features  
Power consumption: 0.9 mA in combo normal mode  
and 1.25 mA in combo high-performance mode up to  
1.6 kHz.  
ST’s family of MEMS sensor modules leverages the  
robust and mature manufacturing processes already  
used for the production of micromachined  
accelerometers and gyroscopes.  
“Always-on” experience with low power  
consumption for both accelerometer and gyroscope  
The various sensing elements are manufactured using  
specialized micromachining processes, while the IC  
interfaces are developed using CMOS technology that  
allows the design of a dedicated circuit which is  
trimmed to better match the characteristics of the  
sensing element.  
Smart FIFO up to 8 kbyte based on features set  
Compliant with Android K and L  
±2/±4/±8/±16 g full scale  
±125/±245/±500/±1000/±2000 dps full scale  
Analog supply voltage: 1.71 V to 3.6 V  
Independent IOs supply (1.62 V)  
The LSM6DS33 has a full-scale acceleration range of  
±2/±4/±8/±16 g and an angular rate range of  
±125/±245/±500/±1000/±2000 dps.  
Compact footprint, 3 mm x 3 mm x 0.86 mm  
SPI/I2C serial interface with main processor data  
synchronization feature  
High robustness to mechanical shock makes the  
LSM6DS33 the preferred choice of system designers  
for the creation and manufacturing of reliable products.  
Embedded temperature sensor  
ECOPACK®, RoHS and “Green” compliant  
The LSM6DS33 is available in a plastic land grid array  
(LGA) package.  
Applications  
Table 1. Device summary  
Temp.  
Pedometer, step detector and step counter  
Significant motion and tilt functions  
Indoor navigation  
Part number  
Package  
Packing  
range [°C]  
LSM6DS33  
-40 to +85  
Tray  
Tap and double-tap detection  
IoT and connected devices  
LGA-16L  
Tape &  
Reel  
(3 x 3 x 0.86 mm)  
LSM6DS33TR -40 to +85  
Intelligent power saving for handheld devices  
Vibration monitoring and compensation  
Free-fall detection  
6D orientation detection  
October 2015  
DocID027423 Rev 4  
1/77  
This is information on a product in full production.  
www.st.com  
 

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