LSM6DS3H
iNEMO inertial module:
always-on 3D accelerometer and 3D gyroscope
Datasheet - production data
Description
The LSM6DS3H is a system-in-package featuring a 3D
digital accelerometer and a 3D digital gyroscope
performing at 1.1 mA (up to 1.6 kHz ODR) in high-
performance mode and enabling always-on low-power
features for an optimal motion experience for the
consumer.
LGA-14L
(2.5 x 3 x 0.83 mm) typ.
Features
The LSM6DS3H supports main OS requirements,
offering real, virtual and batch sensors with 4 kbyte
FIFO + flexible 4 kbyte (FIFO or programmable) for
dynamic data batching.
Power consumption: 0.85 mA in combo normal
mode and 1.1 mA in combo high-performance mode
up to 1.6 kHz.
“Always-on” experience with low power
consumption for both accelerometer and gyroscope
Interface flexibility: selectable SPI (3/4-wire) or I2C
with the main processor
The LSM6DS3H gyroscope supports both OIS/EIS
applications. The device can be connected to the
camera module through a dedicated auxiliary SPI
(Mode 3) while flexibility for the primary interface is
available (I2C/SPI).
Auxiliary SPI (3-wire) to support OIS applications
EIS/OIS support
ST’s family of MEMS sensor modules leverages the
robust and mature manufacturing processes already
used for the production of micromachined
accelerometers and gyroscopes.
Accelerometer ODR up to 6.66 kHz
Gyroscope ODR up to 3.33 kHz
Smart FIFO
The various sensing elements are manufactured using
specialized micromachining processes, while the IC
interfaces are developed using CMOS technology that
allows the design of a dedicated circuit which is
trimmed to better match the characteristics of the
sensing element.
±2/±4/±8/±16 g full scale
±125/±245/±500/±1000/±2000 dps full scale
Analog supply voltage: 1.71 V to 3.6 V
Independent IOs supply (1.62 V)
Compact footprint, 2.5 mm x 3 mm x 0.83 mm
SPI/I2C serial interface data synchronization feature
Embedded temperature sensor
The LSM6DS3H has a full-scale acceleration range of
±2/±4/±8/±16 g and an angular rate range of
±125/±245/±500/±1000/±2000 dps.
ECOPACK®, RoHS and “Green” compliant
High robustness to mechanical shock makes the
LSM6DS3H the preferred choice of system designers
for the creation and manufacturing of reliable products.
Applications
The LSM6DS3H is available in a plastic land grid array
(LGA) package.
EIS and OIS for camera applications
Collecting sensor data
Motion tracking and gesture detection
Pedometer, step detector and step counter
Significant motion and tilt functions
Indoor navigation
Table 1. Device summary
Temp.
range [°C]
Part number
Package
Packing
LSM6DS3H
-40 to +85
Tray
LGA-14L
IoT and connected devices
Tape &
Reel
(2.5 x 3 x 0.83 mm)
LSM6DS3HTR -40 to +85
Vibration monitoring and compensation
February 2016
DocID028370 Rev 4
1/104
This is information on a product in full production.
www.st.com