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LSM6DS3HTR

更新时间： 2024-11-23 01:19:47
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
104页 1557K
描述
always-on 3D accelerometer and 3D gyroscope

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中文翻译

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LSM6DS3HTR 技术参数

生命周期：Active包装说明：VFLGA,
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：16 weeks
风险等级：1.38模拟集成电路 - 其他类型：ANALOG CIRCUIT
JESD-30 代码：R-PBGA-B14长度：3 mm
功能数量：1端子数量：14
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：VFLGA
封装形状：RECTANGULAR封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED座面最大高度：0.86 mm
最大供电电压 (Vsup)：3.6 V最小供电电压 (Vsup)：1.71 V
标称供电电压 (Vsup)：1.8 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子形式：BUTT端子节距：0.5 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：2.5 mmBase Number Matches：1

LSM6DS3HTR 数据手册

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LSM6DS3H  
iNEMO inertial module:  
always-on 3D accelerometer and 3D gyroscope  
Datasheet - production data  
Description  
The LSM6DS3H is a system-in-package featuring a 3D  
digital accelerometer and a 3D digital gyroscope  
performing at 1.1 mA (up to 1.6 kHz ODR) in high-  
performance mode and enabling always-on low-power  
features for an optimal motion experience for the  
consumer.  
LGA-14L  
(2.5 x 3 x 0.83 mm) typ.  
Features  
The LSM6DS3H supports main OS requirements,  
offering real, virtual and batch sensors with 4 kbyte  
FIFO + flexible 4 kbyte (FIFO or programmable) for  
dynamic data batching.  
Power consumption: 0.85 mA in combo normal  
mode and 1.1 mA in combo high-performance mode  
up to 1.6 kHz.  
“Always-on” experience with low power  
consumption for both accelerometer and gyroscope  
Interface flexibility: selectable SPI (3/4-wire) or I2C  
with the main processor  
The LSM6DS3H gyroscope supports both OIS/EIS  
applications. The device can be connected to the  
camera module through a dedicated auxiliary SPI  
(Mode 3) while flexibility for the primary interface is  
available (I2C/SPI).  
Auxiliary SPI (3-wire) to support OIS applications  
EIS/OIS support  
ST’s family of MEMS sensor modules leverages the  
robust and mature manufacturing processes already  
used for the production of micromachined  
accelerometers and gyroscopes.  
Accelerometer ODR up to 6.66 kHz  
Gyroscope ODR up to 3.33 kHz  
Smart FIFO  
The various sensing elements are manufactured using  
specialized micromachining processes, while the IC  
interfaces are developed using CMOS technology that  
allows the design of a dedicated circuit which is  
trimmed to better match the characteristics of the  
sensing element.  
±2/±4/±8/±16 g full scale  
±125/±245/±500/±1000/±2000 dps full scale  
Analog supply voltage: 1.71 V to 3.6 V  
Independent IOs supply (1.62 V)  
Compact footprint, 2.5 mm x 3 mm x 0.83 mm  
SPI/I2C serial interface data synchronization feature  
Embedded temperature sensor  
The LSM6DS3H has a full-scale acceleration range of  
±2/±4/±8/±16 g and an angular rate range of  
±125/±245/±500/±1000/±2000 dps.  
ECOPACK®, RoHS and “Green” compliant  
High robustness to mechanical shock makes the  
LSM6DS3H the preferred choice of system designers  
for the creation and manufacturing of reliable products.  
Applications  
The LSM6DS3H is available in a plastic land grid array  
(LGA) package.  
EIS and OIS for camera applications  
Collecting sensor data  
Motion tracking and gesture detection  
Pedometer, step detector and step counter  
Significant motion and tilt functions  
Indoor navigation  
Table 1. Device summary  
Temp.  
range [°C]  
Part number  
Package  
Packing  
LSM6DS3H  
-40 to +85  
Tray  
LGA-14L  
IoT and connected devices  
Tape &  
Reel  
(2.5 x 3 x 0.83 mm)  
LSM6DS3HTR -40 to +85  
Vibration monitoring and compensation  
February 2016  
DocID028370 Rev 4  
1/104  
This is information on a product in full production.  
www.st.com  
 
1234567...104

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