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LSM6DSV PDF预览

LSM6DSV

更新时间: 2024-11-23 14:57:23
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
189页 9224K
描述
iNEMO惯性模块:3D加速度计和3D陀螺仪

LSM6DSV 数据手册

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LSM6DSV  
Datasheet  
6-axis inertial measurement unit (IMU)  
with embedded sensor fusion, I3C, OIS/EIS for smart applications  
Features  
Triple-channel architecture for UI, EIS, and OIS data processing  
"Always-on" experience with low power consumption for both accelerometer  
and gyroscope  
Smart FIFO up to 4.5 KB  
Android compliant  
±2/±4/±8/±16 g full scale  
±125/±250/±500/±1000/±2000/±4000 dps full scale  
SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data  
synchronization  
Auxiliary SPI for OIS data output for gyroscope and accelerometer  
OIS configurable from aux. SPI, primary interface (SPI / I²C & MIPI I3C® v1.1)  
EIS dedicated channel on primary interface with dedicated filtering  
Advanced pedometer, step detector, and step counter  
Product status link  
LSM6DSV  
Significant motion detection, tilt detection  
Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double  
click  
Product summary  
Programmable finite state machine for accelerometer, gyroscope, and external  
sensor data processing with high rate @ 960 Hz  
Order code  
LSM6DSV LSM6DSVTR  
-40 to +85  
Temperature  
range [°C]  
Embedded adaptive self-configuration (ASC)  
Embedded sensor fusion low-power algorithm  
Embedded temperature sensor  
LGA-14L  
(2.5 x 3.0 x 0.83 mm)  
Package  
Packing  
Analog supply voltage: 1.71 V to 3.6 V  
Tray  
Tape and reel  
Independent IO supply (extended range: 1.08 V to 3.6 V)  
Power consumption: 0.65 mA in combo high-performance mode  
Compact footprint: 2.5 mm x 3 mm x 0.83 mm  
ECOPACK and RoHS compliant  
Product resources  
AN5922 (device application note)  
AN5907 (finite state machine)  
TN0018 (design and soldering)  
Applications  
Motion tracking and gesture detection, augmented reality (AR) / virtual reality  
(VR) / mixed reality (MR) applications & metaverse applications  
Product label  
Wearables  
Indoor navigation  
IoT and connected devices  
Smartphones and handheld devices  
EIS and OIS for camera applications  
Vibration monitoring and compensation  
DS13476 - Rev 5 - August 2023  
www.st.com  
For further information contact your local STMicroelectronics sales office.  

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