Datasheet > LSM6DSV

LSM6DSV

更新时间： 2024-09-18 14:57:23

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
189页	9224K
描述
iNEMO惯性模块：3D加速度计和3D陀螺仪

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中文翻译

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LSM6DSV 数据手册

LSM6DSV

Datasheet

6-axis inertial measurement unit (IMU)

with embedded sensor fusion, I3C, OIS/EIS for smart applications

Features

•

Triple-channel architecture for UI, EIS, and OIS data processing

"Always-on" experience with low power consumption for both accelerometer

and gyroscope

•

Smart FIFO up to 4.5 KB

Android compliant

±2/±4/±8/±16 g full scale

±125/±250/±500/±1000/±2000/±4000 dps full scale

•

SPI / I²C & MIPI I3C^®v1.1 serial interface with main processor data

synchronization

•

Auxiliary SPI for OIS data output for gyroscope and accelerometer

•

OIS configurable from aux. SPI, primary interface (SPI / I²C & MIPI I3C^®v1.1)

EIS dedicated channel on primary interface with dedicated filtering

Advanced pedometer, step detector, and step counter

Product status link

LSM6DSV

Significant motion detection, tilt detection

Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double

click

Product summary

•

Programmable finite state machine for accelerometer, gyroscope, and external

sensor data processing with high rate @ 960 Hz

Order code

LSM6DSV LSM6DSVTR

-40 to +85

Temperature

range [°C]

•

Embedded adaptive self-configuration (ASC)

Embedded sensor fusion low-power algorithm

Embedded temperature sensor

LGA-14L

(2.5 x 3.0 x 0.83 mm)

Package

Packing

Analog supply voltage: 1.71 V to 3.6 V

Tray

Tape and reel

Independent IO supply (extended range: 1.08 V to 3.6 V)

Power consumption: 0.65 mA in combo high-performance mode

Compact footprint: 2.5 mm x 3 mm x 0.83 mm

ECOPACK and RoHS compliant

Product resources

AN5922 (device application note)

AN5907 (finite state machine)

TN0018 (design and soldering)

Applications

•

Motion tracking and gesture detection, augmented reality (AR) / virtual reality

(VR) / mixed reality (MR) applications & metaverse applications

Product label

•

Wearables

Indoor navigation

IoT and connected devices

Smartphones and handheld devices

EIS and OIS for camera applications

Vibration monitoring and compensation

DS13476 - Rev 5 - August 2023

www.st.com

For further information contact your local STMicroelectronics sales office.

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中文翻译

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