Datasheet > LSM6DSV32X

LSM6DSV32X

更新时间： 2024-11-23 14:58:07

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
12页	550K
描述
iNEMO inertial module: 3D accelerometer and 3D gyroscope

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中文翻译

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数据手册

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LSM6DSV32X 数据手册

LSM6DSV32X

Data brief

6-axis inertial measurement unit (IMU) and AI sensor with 32 g accelerometer

and embedded sensor fusion, Qvar for high-end applications

Features

•

Triple-channel architecture for UI, EIS, and OIS data processing

"Always-on" experience with low power consumption for both accelerometer

and gyroscope

LSM6DSV32X

•

Smart FIFO up to 4.5 KB

Android compliant

±4/±8/±16/±32 g full scale

±125/±250/±500/±1000/±2000/±4000 dps full scale

•

SPI / I²C & MIPI I3C^®v1.1 serial interface with main processor data

synchronization

LGA-14L

(2.5 x 3.0 x 0.83 mm) typ.

•

Auxiliary SPI for OIS data output for gyroscope and accelerometer

•

OIS configurable from aux. SPI, primary interface (SPI / I²C & MIPI I3C^®v1.1)

EIS dedicated channel on primary interface with dedicated filtering

Advanced pedometer, step detector, and step counter

Significant motion detection, tilt detection

Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double

click

•

Programmable finite state machine for accelerometer, gyroscope, and external

sensor data processing with high rate @ 960 Hz

•

Machine learning core with exportable features and filters for AI applications

Embedded adaptive self-configuration (ASC)

Product status link

LSM6DSV32X

Embedded Qvar (electrostatic sensor) for user interface functions (tap, double

tap, triple tap, long press, L/R – R/L swipe)

•

Embedded analog hub for ADC and processing analog input data

Embedded sensor fusion low-power algorithm

Embedded temperature sensor

Product summary

Order code LSM6DSV32X LSM6DSV32XTR

Temperature

-40 to +85

Analog supply voltage: 1.71 V to 3.6 V

range [°C]

Independent IO supply (extended range: 1.08 V to 3.6 V)

Power consumption: 0.65 mA in combo high-performance mode

Compact footprint: 2.5 mm x 3 mm x 0.83 mm

ECOPACK and RoHS compliant

LGA-14L

Package

(2.5 x 3.0 x 0.83 mm)

Packing

Tray

Tape and reel

Product resources

Applications

TN0018 (design and soldering)

•

Wearables

Smartphones and handheld devices

IoT and connected devices

Product label

Motion tracking and gesture detection, augmented reality (AR) / virtual reality

(VR) / mixed reality (MR) applications & metaverse applications

•

Indoor navigation

EIS and OIS for camera applications

Vibration monitoring and compensation

DB5042 - Rev 1 - June 2023

For further information contact your local STMicroelectronics sales office.

www.st.com

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中文翻译

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