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LSM6DSRX

更新时间： 2024-11-23 14:58:15
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
171页 2621K
描述
iNEMO惯性模块：3D加速度计和3D 陀螺仪，具有嵌入式机器学习核心

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中文翻译

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LSM6DSRX 数据手册

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LSM6DSRX  
Datasheet  
iNEMO inertial module with embedded Machine Learning Core: always-on 3D  
accelerometer and 3D gyroscope  
Features  
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Extended full-scale range for gyroscope up to 4000 dps  
High stability over temperature and time  
Smart FIFO up to 9 kbytes  
LGA-14L  
(2.5 x 3.0 x 0.83 mm) typ.  
Android compliant  
Auxiliary SPI for OIS data output for gyroscope and accelerometer  
±2/±4/±8/±16 g full scale  
±125/±250/±500/±1000/±2000/±4000 dps full scale  
Analog supply voltage: 1.71 V to 3.6 V  
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SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization  
Supports sensor synchronization S4S for Qualcomm, full spec compliant (I²C,  
MIPI I3CSM, SPI)  
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Advanced pedometer, step detector and step counter  
Significant Motion Detection, tilt detection  
Programmable Finite State Machine: accelerometer, gyroscope, and external  
sensors  
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Machine Learning Core  
Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click  
Embedded temperature sensor  
ECOPACK, RoHS and “Green” compliant  
Product status link  
Applications  
LSM6DSRX  
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Motion tracking and gesture detection  
Virtual and augmented reality  
OIS for camera applications  
Sensor hub  
Product summary  
Order code  
LSM6DSRX  
LSM6DSRXTR  
Temp. range  
[°C]  
-40 to +85  
Indoor navigation  
LGA-14L  
(2.5 x 3.0 x 0.83 mm)  
IoT and connected devices  
Sports applications  
Package  
Packing  
Tray  
Tape & Reel  
Vibration monitoring and compensation  
Drones  
Product label  
Robotics  
High-precision systems  
Description  
The LSM6DSRX is a system-in-package featuring a 3D digital accelerometer and a  
3D digital gyroscope with an extended full-scale range for the gyroscope, up to 4000  
dps, and high stability over temperature and time.  
Product resources  
AN5382 (LSM6DSRX)  
The LSM6DSRX supports main OS requirements, offering real, virtual and batch  
sensors with 9 kbytes with FIFO compression up to three times for dynamic data  
batching.  
AN5393 (Machine Learning Core)  
AN5389 (Finite State Machine)  
TN0018 (Design and soldering)  
DS13007 - Rev 3 - November 2020  
www.st.com  
For further information contact your local STMicroelectronics sales office.  
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