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LSM6DSM PDF预览

LSM6DSM

更新时间: 2024-09-18 01:19:47
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
113页 1780K
描述
always-on 3D accelerometer and 3D gyroscope

LSM6DSM 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:VFLGA,Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.59
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:R-PBGA-B14
JESD-609代码:e4长度:3 mm
湿度敏感等级:3功能数量:1
端子数量:14最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:VFLGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
座面最大高度:0.86 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):1.71 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Gold (Au) - with Nickel (Ni) barrier
端子形式:BUTT端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:2.5 mmBase Number Matches:1

LSM6DSM 数据手册

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LSM6DSM  
iNEMO inertial module:  
always-on 3D accelerometer and 3D gyroscope  
Datasheet - preliminary data  
EIS and OIS for camera applications  
Vibration monitoring and compensation  
LGA-14L  
(2.5 x 3 x 0.83 mm) typ.  
Description  
The LSM6DSM is a system-in-package featuring a 3D  
digital accelerometer and a 3D digital gyroscope  
performing at 0.65 mA in high-performance mode and  
enabling always-on low-power features for an optimal  
motion experience for the consumer.  
Features  
Power consumption: 0.4 mA in combo normal mode  
and 0.65 mA in combo high-performance mode  
The LSM6DSM supports main OS requirements,  
offering real, virtual and batch sensors with 4 kbyte for  
dynamic data batching.  
“Always-on” experience with low power  
consumption for both accelerometer and gyroscope  
Smart FIFO up to 4 kbyte based on features set  
Compliant with Android K, L, and M  
ST’s family of MEMS sensor modules leverages the  
robust and mature manufacturing processes already  
used for the production of micromachined  
accelerometers and gyroscopes.  
Hard, soft ironing for external magnetic sensor  
corrections  
±2/±4/±8/±16 g full scale  
The various sensing elements are manufactured using  
specialized micromachining processes, while the IC  
interfaces are developed using CMOS technology that  
allows the design of a dedicated circuit which is  
trimmed to better match the characteristics of the  
sensing element.  
±125/±245/±500/±1000/±2000 dps full scale  
Analog supply voltage: 1.71 V to 3.6 V  
Independent IOs supply (1.62 V)  
Compact footprint, 2.5 mm x 3 mm x 0.83 mm  
SPI & I2C serial interface with main processor data  
synchronization feature  
The LSM6DSM has a full-scale acceleration range of  
±2/±4/±8/±16 g and an angular rate range of  
±125/±245/±500/±1000/±2000 dps.  
Dedicated gyroscope low-pass filters for UI and OIS  
applications  
The LSM6DSM fully supports EIS and OIS applications  
as the module includes a dedicated configurable signal  
processing path for OIS and auxiliary dedicated low-  
pass filtering.  
Auxiliary dedicated SPI for OIS data output  
Pedometer, step detector and step counter  
Significant motion and tilt function  
Standard interrupts: free-fall, wakeup, 6D/4D  
orientation, click and double-click  
High robustness to mechanical shock makes the  
LSM6DSM the preferred choice of system designers for  
the creation and manufacturing of reliable products.  
Embedded temperature sensor  
ECOPACK®, RoHS and “Green” compliant  
The LSM6DSM is available in a plastic land grid array  
(LGA) package.  
Applications  
Table 1. Device summary  
Temp.  
Motion tracking and gesture detection  
Collecting sensor data  
Part number  
Package  
Packing  
range [°C]  
Indoor navigation  
LSM6DSM  
-40 to +85  
Tray  
IoT and connected devices  
LGA-14L  
Tape &  
Reel  
Intelligent power saving for handheld devices  
(2.5x3x0.83mm)  
LSM6DSMTR -40 to +85  
February 2016  
DocID028165 Rev 2  
1/113  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to  
change without notice.  
www.st.com  
 

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