生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | TFBGA, | 针数: | 48 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.62 |
最长访问时间: | 100 ns | 备用内存宽度: | 8 |
JESD-30 代码: | S-PBGA-B48 | 长度: | 9 mm |
内存密度: | 67108864 bit | 内存集成电路类型: | MASK ROM |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 48 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 4MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 并行/串行: | PARALLEL |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | BALL | 端子节距: | 0.75 mm |
端子位置: | BOTTOM | 宽度: | 9 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
KM23V64005BF-12 | SAMSUNG |
获取价格 |
MASK ROM, 4MX16, 120ns, CMOS, PBGA48, 0.75 MM PITCH, CSP, BGA-48 |
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KM23V64005BT-10 | SAMSUNG |
获取价格 |
MASK ROM, 4MX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 |
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KM23V64205ASG | SAMSUNG |
获取价格 |
MASK ROM, 4MX16, 120ns, CMOS, PDSO70, 0.500 INCH, SSOP-70 |
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KM23V8000B-20 | SAMSUNG |
获取价格 |
MASK ROM, 1MX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 |
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KM23V8000C-20 | SAMSUNG |
获取价格 |
MASK ROM, 1MX8, 200ns, CMOS, PDIP32 |
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KM23V8000C-25 | SAMSUNG |
获取价格 |
MASK ROM, 1MX8, 250ns, CMOS, PDIP32 |
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KM23V8000CG-15 | SAMSUNG |
获取价格 |
MASK ROM, 1MX8, 150ns, CMOS, PDSO32 |
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KM23V8000CG-20 | SAMSUNG |
获取价格 |
MASK ROM, 1MX8, 200ns, CMOS, PDSO32 |
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KM23V8000CG-25 | SAMSUNG |
获取价格 |
MASK ROM, 1MX8, 250ns, CMOS, PDSO32 |
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KM23V8000D-10 | SAMSUNG |
获取价格 |
MASK ROM, 1MX8, 100ns, CMOS, PDIP32, 0.600 INCH, DIP-32 |
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