5秒后页面跳转
K6T1008C2C-TF70 PDF预览

K6T1008C2C-TF70

更新时间: 2024-09-19 21:53:51
品牌 Logo 应用领域
三星 - SAMSUNG /
页数 文件大小 规格书
10页 191K
描述
128K x8 bit Low Power CMOS Static RAM

K6T1008C2C-TF70 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP1包装说明:TSOP1, TSSOP32,.8,20
针数:32Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.41
风险等级:5.7最长访问时间:70 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G32
JESD-609代码:e0长度:18.4 mm
内存密度:1048576 bit内存集成电路类型:STANDARD SRAM
内存宽度:8功能数量:1
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装等效代码:TSSOP32,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
认证状态:Not Qualified座面最大高度:1.2 mm
最小待机电流:2 V子类别:SRAMs
最大压摆率:0.06 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:8 mmBase Number Matches:1

K6T1008C2C-TF70 数据手册

 浏览型号K6T1008C2C-TF70的Datasheet PDF文件第2页浏览型号K6T1008C2C-TF70的Datasheet PDF文件第3页浏览型号K6T1008C2C-TF70的Datasheet PDF文件第4页浏览型号K6T1008C2C-TF70的Datasheet PDF文件第5页浏览型号K6T1008C2C-TF70的Datasheet PDF文件第6页浏览型号K6T1008C2C-TF70的Datasheet PDF文件第7页 
PRELIMINARY  
K6T1008C2C Family  
CMOS SRAM  
Document Title  
128K x8 bit Low Power CMOS Static RAM  
Revision History  
Revision No.  
History  
Draft Date  
Remark  
0.0  
Initial draft  
November 22, 1995  
April 15, 1996  
Design target  
Preliminary  
0.1  
1.0  
2.0  
First revision  
- Seperate read and write at ICC, ICC1  
ICC = ICC1 ® Read : 15mA, Write : 35mA  
Finalized  
September 5, 1996  
November 5, 1997  
Final  
Final  
- Add 70ns speed bin for commercial product and 85ns speed  
bin for industrial.  
Revised  
- Improved operating current  
Add typical value.  
ICC Read : 15mA ® 10mA(Remove write current)  
ICC2 : 90mA ® 60mA  
- Speed bin change  
Remove 45ns from commercial part  
Remove 55ns and 100ns from industrial part.  
The attached data sheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and  
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.  
Revision 2.0  
1
November 1997  

K6T1008C2C-TF70 替代型号

型号 品牌 替代类型 描述 数据表
M5M51008DVP-70HI RENESAS

功能相似

128KX8 STANDARD SRAM, 70ns, PDSO32, 8 X 20 MM, TSOP-32

与K6T1008C2C-TF70相关器件

型号 品牌 获取价格 描述 数据表
K6T1008C2C-TF700 SAMSUNG

获取价格

Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32
K6T1008C2C-YL700 SAMSUNG

获取价格

Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32
K6T1008C2C-YP700 SAMSUNG

获取价格

Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32
K6T1008C2E SAMSUNG

获取价格

128Kx8 bit Low Power CMOS Static RAM
K6T1008C2E-B SAMSUNG

获取价格

128Kx8 bit Low Power CMOS Static RAM
K6T1008C2E-DB55 SAMSUNG

获取价格

128Kx8 bit Low Power CMOS Static RAM
K6T1008C2E-DB550 SAMSUNG

获取价格

Standard SRAM, 128KX8, 55ns, CMOS, PDIP32, 0.600 INCH, DIP-32
K6T1008C2E-DB70 SAMSUNG

获取价格

128Kx8 bit Low Power CMOS Static RAM
K6T1008C2E-DB700 SAMSUNG

获取价格

Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, 0.600 INCH, DIP-32
K6T1008C2E-DB7000 SAMSUNG

获取价格

Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, 0.600 INCH, DIP-32