5秒后页面跳转
K6R1008V1B-TI8T PDF预览

K6R1008V1B-TI8T

更新时间: 2024-01-31 23:35:41
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
9页 184K
描述
Standard SRAM, 128KX8, 8ns, CMOS, PDSO32

K6R1008V1B-TI8T 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TSOP, TSOP32,.46Reach Compliance Code:unknown
风险等级:5.92最长访问时间:8 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G32
JESD-609代码:e0内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP
封装等效代码:TSOP32,.46封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
电源:3.3 V认证状态:Not Qualified
最大待机电流:0.005 A最小待机电流:3 V
子类别:SRAMs最大压摆率:0.16 mA
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
Base Number Matches:1

K6R1008V1B-TI8T 数据手册

 浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第1页浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第2页浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第3页浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第5页浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第6页浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第7页 
Preliminary  
PRELIMINARY  
CMOS SRAM  
K6R1008V1B-C/B-L, K6R1008V1B-I/B-P  
AC CHARACTERISTICS(TA=0 to 70°C, VCC=3.3±0.3V, unless otherwise noted.)  
TEST CONDITIONS*  
Parameter  
Value  
0V to 3V  
Input Pulse Levels  
Input Rise and Fall Times  
3ns  
1.5V  
Input and Output timing Reference Levels  
Output Loads  
See below  
* The above test conditions are also applied at industrial temperature range.  
Output Loads(A)  
Output Loads(B)  
for tHZ, tLZ, tWHZ, tOW, tOLZ & tOHZ  
+3.3V  
RL = 50W  
DOUT  
VL = 1.5V  
30pF*  
319W  
DOUT  
ZO = 50W  
353W  
5pF*  
* Capacitive Load consists of all components of the  
test environment.  
* Including Scope and Jig Capacitance  
READ CYCLE*  
K6R1008V1B-8  
K6R1008V1B-10  
K6R1008V1B-12  
Parameter  
Symbol  
Unit  
Min  
8
-
Max  
Min  
10  
-
Max  
Min  
12  
-
Max  
Read Cycle Time  
tRC  
tAA  
tCO  
tOE  
tLZ  
-
8
8
4
-
-
10  
10  
5
-
12  
12  
6
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address Access Time  
Chip Select to Output  
-
-
-
Output Enable to Valid Output  
Chip Enable to Low-Z Output  
Output Enable to Low-Z Output  
Chip Disable to High-Z Output  
Output Disable to High-Z Output  
Output Hold from Address Change  
Chip Selection to Power Up Time  
Chip Selection to Power DownTime  
-
-
-
3
0
0
0
3
0
-
3
-
3
-
tOLZ  
tHZ  
tOHZ  
tOH  
tPU  
-
0
-
0
-
4
4
-
0
5
0
6
0
5
0
6
3
-
3
-
-
0
-
0
-
tPD  
8
-
10  
-
12  
* The above parameters are also guaranteed at industrial temperature range.  
Rev 2.1  
August 1998  
- 4 -  

与K6R1008V1B-TI8T相关器件

型号 品牌 描述 获取价格 数据表
K6R1008V1B-TL10 SAMSUNG Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32

获取价格

K6R1008V1B-TL10T SAMSUNG Standard SRAM, 128KX8, 10ns, CMOS, PDSO32

获取价格

K6R1008V1B-TL12 SAMSUNG Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32

获取价格

K6R1008V1B-TL12T SAMSUNG Standard SRAM, 128KX8, 12ns, CMOS, PDSO32

获取价格

K6R1008V1B-TL8T SAMSUNG Standard SRAM, 128KX8, 8ns, CMOS, PDSO32

获取价格

K6R1008V1B-TP10 SAMSUNG Standard SRAM, 128KX8, 10ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32

获取价格