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K6R1008V1B-TI8T PDF预览

K6R1008V1B-TI8T

更新时间: 2024-01-19 23:14:44
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
9页 184K
描述
Standard SRAM, 128KX8, 8ns, CMOS, PDSO32

K6R1008V1B-TI8T 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TSOP, TSOP32,.46Reach Compliance Code:unknown
风险等级:5.92最长访问时间:8 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G32
JESD-609代码:e0内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP
封装等效代码:TSOP32,.46封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
电源:3.3 V认证状态:Not Qualified
最大待机电流:0.005 A最小待机电流:3 V
子类别:SRAMs最大压摆率:0.16 mA
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
Base Number Matches:1

K6R1008V1B-TI8T 数据手册

 浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第1页浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第2页浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第4页浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第5页浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第6页浏览型号K6R1008V1B-TI8T的Datasheet PDF文件第7页 
Preliminary  
PRELIMINARY  
CMOS SRAM  
K6R1008V1B-C/B-L, K6R1008V1B-I/B-P  
ABSOLUTE MAXIMUM RATINGS*  
Parameter  
Voltage on Any Pin Relative to VSS  
Voltage on VCC Supply Relative to VSS  
Power Dissipation  
Symbol  
VIN, VOUT  
VCC  
Rating  
-0.5 to 4.6  
-0.5 to 4.6  
1.0  
Unit  
V
V
PD  
W
Storage Temperature  
TSTG  
TA  
-65 to 150  
0 to 70  
°C  
°C  
°C  
Operating Temperature  
Commercial  
Industrial  
TA  
-40 to 85  
* Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and  
functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied.  
Exposure to absolute maximum rating conditions for extended periods may affect reliability.  
RECOMMENDED DC OPERATING CONDITIONS*(TA=0 to 70°C)  
Parameter  
Min  
Symbol  
VCC  
VSS  
Typ  
Max  
Unit  
V
Supply Voltage  
3.0  
3.3  
3.6  
Ground  
0
0
-
0
V
V
Input High Voltage  
Input Low Voltage  
VIH  
2.0  
VCC+0.3***  
0.8  
V
VIL  
-0.3**  
-
*
The above parameters are also guaranteed at industrial temperature range.  
** VIL(Min) = -2.0V a.c(Pulse Width £ 6ns) for I £ 20mA.  
*** VIH(Max) = VCC + 2.0V a.c (Pulse Width £ 6ns) for I £ 20mA.  
DC AND OPERATING CHARACTERISTICS*(TA=0 to 70°C, Vcc=3.3±0.3V, unless otherwise specified)  
Parameter  
Input Leakage Current  
Output Leakage Current  
Symbol  
Test Conditions  
Min  
Max  
Unit  
ILI  
VIN = VSS to VCC  
-2  
2
mA  
ILO  
CS=VIH or OE=VIH or WE=VIL  
VOUT = VSS to VCC  
-2  
2
mA  
Operating Current  
ICC  
Min. Cycle, 100% Duty  
CS=VIL, VIN = VIH or VIL,  
IOUT=0mA  
8ns  
10ns  
12ns  
-
160  
155  
150  
50  
mA  
-
-
Standby Current  
ISB  
Min. Cycle, CS=VIH  
-
mA  
mA  
ISB1  
f=0MHz, CS ³ VCC-0.2V,  
VIN³ VCC-0.2V or VIN£0.2V  
Normal  
L-Ver.  
-
-
5
0.7  
0.4  
-
Output Low Voltage Level  
Output High Voltage Level  
VOL  
VOH  
IOL=8mA  
-
V
V
IOH=-4mA  
2.4  
* The above parameters are also guaranteed at industrial temperature range.  
CAPACITANCE*(TA=25°C, f=1.0MHz)  
Item  
Symbol  
Test Conditions  
VI/O=0V  
MIN  
Max  
8
Unit  
Input/Output Capacitance  
Input Capacitance  
CI/O  
-
-
pF  
pF  
CIN  
VIN=0V  
6
* Capacitance is sampled and not 100% tested.  
Rev 2.1  
August 1998  
- 3 -  

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