是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | FBGA, BGA60,9X11,32 | Reach Compliance Code: | unknown |
风险等级: | 5.84 | 最长访问时间: | 0.4 ns |
最大时钟频率 (fCLK): | 400 MHz | I/O 类型: | COMMON |
交错的突发长度: | 4,8 | JESD-30 代码: | R-PBGA-B60 |
内存密度: | 1073741824 bit | 内存集成电路类型: | DDR DRAM |
内存宽度: | 8 | 端子数量: | 60 |
字数: | 134217728 words | 字数代码: | 128000000 |
组织: | 128MX8 | 输出特性: | 3-STATE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FBGA |
封装等效代码: | BGA60,9X11,32 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, FINE PITCH | 电源: | 1.8 V |
认证状态: | Not Qualified | 刷新周期: | 8192 |
连续突发长度: | 4,8 | 子类别: | DRAMs |
最大压摆率: | 0.25 mA | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K4T1G084QQ-HCLE6 | SAMSUNG |
获取价格 |
1Gb Q-die DDR2 SDRAM Specification | |
K4T1G084QQ-HCLE7 | SAMSUNG |
获取价格 |
1Gb Q-die DDR2 SDRAM Specification | |
K4T1G084QQ-HCLF7 | SAMSUNG |
获取价格 |
1Gb Q-die DDR2 SDRAM Specification | |
K4T1G084QQ-HLD60 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 | |
K4T1G084QQ-HLE6 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60 | |
K4T1G084QQ-HLE60 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 | |
K4T1G084QQ-HLE7 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60 | |
K4T1G084QQ-HLE70 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 | |
K4T1G084QQ-HLF70 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 | |
K4T1G084QQ-HLF7T | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60 |