是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | FBGA, BGA60,9X11,32 | Reach Compliance Code: | unknown |
风险等级: | 5.32 | 最长访问时间: | 0.45 ns |
最大时钟频率 (fCLK): | 333 MHz | I/O 类型: | COMMON |
交错的突发长度: | 4,8 | JESD-30 代码: | R-PBGA-B60 |
内存密度: | 1073741824 bit | 内存集成电路类型: | DDR DRAM |
内存宽度: | 8 | 湿度敏感等级: | 3 |
端子数量: | 60 | 字数: | 134217728 words |
字数代码: | 128000000 | 组织: | 128MX8 |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA60,9X11,32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, FINE PITCH |
电源: | 1.8 V | 认证状态: | Not Qualified |
刷新周期: | 8192 | 连续突发长度: | 4,8 |
子类别: | DRAMs | 最大压摆率: | 0.145 mA |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K4T1G084QF-BCE6000 | SAMSUNG |
获取价格 |
1Gb F-die DDR2 SDRAM | |
K4T1G084QF-BCE7 | SAMSUNG |
获取价格 |
1Gb F-die DDR2 SDRAM | |
K4T1G084QF-BCE7T | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60 | |
K4T1G084QF-BCF7 | SAMSUNG |
获取价格 |
1Gb F-die DDR2 SDRAM | |
K4T1G084QF-BCF70 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 | |
K4T1G084QF-BIE6T | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60 | |
K4T1G084QF-BIE70 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 | |
K4T1G084QF-BIF7 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60 | |
K4T1G084QF-BIF70 | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 | |
K4T1G084QF-BIF7T | SAMSUNG |
获取价格 |
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60 |