是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | TSOP1 | 包装说明: | TSOP1, |
针数: | 48 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.71 |
风险等级: | 5.92 | 最长访问时间: | 100 ns |
备用内存宽度: | 8 | JESD-30 代码: | R-PDSO-G48 |
长度: | 16.4 mm | 内存密度: | 67108864 bit |
内存集成电路类型: | MASK ROM | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 48 |
字数: | 4194304 words | 字数代码: | 4000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 4MX16 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP1 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 240 |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 12 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K3P7C1000B-YC12 | SAMSUNG |
获取价格 |
MASK ROM, 4MX16, 120ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | |
K3P7C1000B-YC15 | SAMSUNG |
获取价格 |
MASK ROM, 4MX16, 150ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | |
K3P7C1000B-YC150 | SAMSUNG |
获取价格 |
MASK ROM, 4MX16, 150ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | |
K3P7P1000B-FC10 | SAMSUNG |
获取价格 |
MASK ROM, 4MX16, 100ns, CMOS, PBGA48, 0.75 MM PITCH, FBGA-48 | |
K3P7Q1000B-FC10 | SAMSUNG |
获取价格 |
MASK ROM, 4MX16, 100ns, CMOS, PBGA48, 0.75 MM PITCH, FBGA-48 | |
K3P7U1000A-GC12 | SAMSUNG |
获取价格 |
MASK ROM, 4MX16, 120ns, CMOS, PDSO44, 0.600 INCH, SOP-44 | |
K3P7U1000A-YC | SAMSUNG |
获取价格 |
MASK ROM | |
K3P7U1000A-YC12 | SAMSUNG |
获取价格 |
MASK ROM, 4MX16, 120ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | |
K3P7U1000B-FC | SAMSUNG |
获取价格 |
MASK ROM | |
K3P7U1000B-FC12 | SAMSUNG |
获取价格 |
MASK ROM, 4MX16, 120ns, CMOS, PBGA48, 0.75 MM PITCH, FBGA-48 |