IRHNA7064 (JANSR2N7431U)
Radiation Hardened Power MOSFET (SMD-2)
Device Characteristics
2
Device Characteristics
2.1
Electrical Characteristics (Pre-Irradiation)
Table 3
Symbol
Static and Dynamic Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter
Min. Typ. Max. Unit Test Conditions
Drain-to-Source Breakdown
Voltage
BVDSS
60
—
—
—
—
V
VGS = 0V, ID = 1.0mA
Breakdown Voltage Temp.
Coefficient
BVDSS/TJ
RDS(on)
0.056
V/°C Reference to 25°C, ID = 1.0mA
—
—
2.0
18
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0.015
0.018
4.0
VGS = 12V, ID2 = 56A 1
Static Drain-to-Source On-State
Resistance
VGS = 12V, ID1 = 75A1
VGS(th)
Gfs
Gate Threshold Voltage
V
S
VDS = VGS, ID = 1mA
VDS = 15V, ID2 = 35A 1
VDS = 48V, VGS = 0V
VDS = 48V,VGS = 0V,TJ = 125°C
VGS = 20V
Forward Transconductance
—
25
IDSS
IGSS
Zero Gate Voltage Drain Current
A
250
100
-100
270
60
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
nA
VGS = -20V
QG
ID1 = 75A
QGS
QGD
td(on)
tr
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
nC VDS = 30V
VGS = 12V
110
27
ID1 = 75A **
VDD = 30V
RG = 2.35
VGS = 12V
120
120
100
ns
td(off)
tf
Turn-Off Delay Time
Fall Time
Measured from Drain lead (6mm /
0.25 in from package) to Source lead
(6mm/ 0.25 in from package) with
Source wire internally bonded from
Source pin to Drain pad
Ls +LD
Total Inductance
—
6.8
—
nH
Ciss
Coss
Crss
Input Capacitance
—
—
—
4900
2800
860
—
—
—
VGS = 0V
pF VDS = 25V
Output Capacitance
ƒ = 1.0MHz
Reverse Transfer Capacitance
** Switching speed maximum limits are based on manufacturing test equipment and capability.
1 Pulse width 300 µs; Duty Cycle 2%
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2021-06-24