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JANTXVIN6627US PDF预览

JANTXVIN6627US

更新时间: 2024-11-05 15:35:47
品牌 Logo 应用领域
美高森美 - MICROSEMI 超快恢复二极管快速恢复二极管
页数 文件大小 规格书
4页 264K
描述
Rectifier Diode, 1 Phase, 1 Element, 1.55A, 400V V(RRM), Silicon, HERMETIC SEALED, GLASS, D-5B, 2 PIN

JANTXVIN6627US 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:O-LELF-R2针数:2
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:5.92
其他特性:HIGH RELIABILITY应用:ULTRA FAST RECOVERY
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJESD-30 代码:O-LELF-R2
JESD-609代码:e0最大非重复峰值正向电流:75 A
元件数量:1相数:1
端子数量:2最大输出电流:1.55 A
封装主体材料:GLASS封装形状:ROUND
封装形式:LONG FORM峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified最大重复峰值反向电压:400 V
最大反向恢复时间:0.03 µs表面贴装:YES
端子面层:TIN LEAD端子形式:WRAP AROUND
端子位置:END处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

JANTXVIN6627US 数据手册

 浏览型号JANTXVIN6627US的Datasheet PDF文件第2页浏览型号JANTXVIN6627US的Datasheet PDF文件第3页浏览型号JANTXVIN6627US的Datasheet PDF文件第4页 
1N6626US thru 1N6631US  
VOIDLESS-HERMETICALLY-SEALED  
SURFACE MOUNT ULTRA FAST  
RECOVERY GLASS RECTIFIERS  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This “Ultrafast Recovery” rectifier diode series is military qualified to MIL-PRF-  
19500/590 and is ideal for high-reliability applications where a failure cannot be  
tolerated. These industry-recognized 2.0 to 4.0 Amp rated rectifiers for working  
peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-  
glass construction using an internal “Category I” metallurgical bond. These devices  
are also available in axial-leaded packages for thru-hole mounting (see separate  
data sheet for 1N6626 thru 1N6631). Microsemi also offers numerous other rectifier  
products to meet higher and lower current ratings with various recovery time speed  
requirements including standard, fast and ultrafast device types in both through-hole  
and surface mount packages.  
Package “E”  
or D-5B  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Surface mount series equivalent to the JEDEC registered  
1N6626 to 1N6631 series  
Ultrafast recovery rectifier series 200 to 1000 V  
Military and other high-reliability applications  
Switching power supplies or other applications  
requiring extremely fast switching & low forward  
loss  
High forward surge current capability  
Low thermal resistance  
Voidless hermetically sealed glass package  
Extremely robust construction  
Triple-layer passivation  
Internal “Category I” Metallurgical bonds  
JAN, JANTX, and JANTXV available per MIL-PRF-  
19500/590  
Controlled avalanche with peak reverse power  
capability  
Further options for screening in accordance with MIL-  
PRF-19500 for JANS by using a “MSP” prefix, e.g.  
MSP6626US, MSP6629US, etc.  
Inherently radiation hard as described in Microsemi  
MicroNote 050  
Axial-leaded equivalents also available (see separate data  
sheet for 1N6626 thru 1N6631)  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Junction Temperature: -65oC to +175oC  
Storage Temperature: -65oC to +175oC  
CASE: Hermetically sealed voidless hard glass  
with Tungsten slugs  
Peak Forward Surge Current @ 25oC: 75A (except  
1N6631 which is 60A)  
Note: Test pulse = 8.3ms, half-sine wave.  
Average Rectified Forward Current (IO) at TEC = +110oC:  
TERMINATIONS: End caps are Copper with  
Tin/Lead (Sn/Pb) finish. Note: Previous  
inventory had solid Silver end caps with  
Tin/Lead finish.  
MARKING: Cathode band only  
POLARITY: Cathode indicated by band  
Tape & Reel option: Standard per EIA-481-B  
Weight: 539 mg  
1N6626US thru 1N6628US  
1N6629US thru 1N6631US  
4.0 A  
2.8 A  
(Derate linearly at 1.5%/oC for TEC > +110oC)  
Average Rectified Forward Current (IO) at TA=25oC:  
See package dimensions and recommended  
pad layout on last page  
1N6626US thru 1N6628US  
1N6629US thru 1N6631US  
1.55 A  
1.15 A  
(Derate linearly at 0.67%/ oC for TA>+25oC. This IO rating  
is for PC boards where thermal resistance from mounting  
point to ambient is sufficiently controlled where TJ(max) is  
not exceeded. See latest issue of MIL-PRF-19500/590)  
Thermal Resistance junction to endcap (RθJEC): 10oC/W  
Capacitance at VR= 10 V: 40 pF  
Solder temperature: 260oC for 10 s (maximum)  
Copyright © 2007  
6-07-2007 REV D  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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