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IXTV250N075TS PDF预览

IXTV250N075TS

更新时间: 2024-02-12 09:25:55
品牌 Logo 应用领域
IXYS 局域网开关脉冲晶体管
页数 文件大小 规格书
5页 285K
描述
Power Field-Effect Transistor, 250A I(D), 75V, 0.004ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, PLUS220SMD, 3 PIN

IXTV250N075TS 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:SMALL OUTLINE, R-PSSO-G2
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.84
其他特性:AVALANCHE RATED雪崩能效等级(Eas):1500 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:75 V最大漏极电流 (ID):250 A
最大漏源导通电阻:0.004 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):560 A认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXTV250N075TS 数据手册

 浏览型号IXTV250N075TS的Datasheet PDF文件第1页浏览型号IXTV250N075TS的Datasheet PDF文件第3页浏览型号IXTV250N075TS的Datasheet PDF文件第4页浏览型号IXTV250N075TS的Datasheet PDF文件第5页 
IXTV250N075T  
IXTV250N075TS  
Symbol  
TestConditions  
Characteristic Values  
PLUS220 (IXTV) Outline  
(TJ = 25°C unless otherwise specified)  
Min.  
Typ.  
Max.  
gfs  
VDS= 10 V; ID = 60 A, Note 1  
75  
122  
S
Ciss  
Coss  
Crss  
9900  
1330  
285  
pF  
pF  
pF  
VGS = 0 V, VDS = 25 V, f = 1 MHz  
td(on)  
tr  
td(off)  
tf  
32  
50  
58  
45  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 VDSS, ID = 50 A  
RG = 3.3 (External)  
Terminals:  
1 - Gate  
2 - Drain  
3 - Source  
Tab - Drain  
Qg(on)  
Qgs  
200  
50  
nC  
nC  
nC  
VGS= 10 V, VDS = 0.5 VDSS, ID = 25 A  
Qgd  
60  
RthJC  
RthCS  
0.27°C/W  
°C/W  
PLUS220  
.25  
Source-Drain Diode  
Symbol  
Values  
Test Conditions  
(TJ = 25°C unless otherwise specified)  
Characteristic  
Min. Typ.  
Max.  
250  
560  
1.0  
IS  
VGS = 0 V  
A
A
PLUS220SMD (IXTV_S) Outline  
ISM  
VSD  
trr  
Pulse width limited by TJM  
IF = 50 A, VGS = 0 V, Note 1  
V
IF = 50 A, -di/dt = 100 A/µs  
80  
ns  
VR = 25 V, VGS = 0 V  
Note 1. Pulse test, t 300 µs, duty cycle d 2 %;  
2. On through-hole packages, RDS(on) Kelvin test contact  
location is 5 mm or less from the package body.  
PRELIMINARYTECHNICALINFORMATION  
The product presented herein is under development. The Technical Specifications  
offered are derived from data gathered during objective characterizations of preliminary  
engineering lots; but also may yet contain some information supplied during a pre-  
production design evaluation. IXYS reserves the right to change limits, test conditions,  
and dimensions without notice.  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered by  
oneormoreofthefollowingU.S.patents:  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,381,025  
5,486,715  
6,162,665  
6,259,123B1  
6,306,728 B1  
6,404,065B1  
6,534,343  
6,583,505  
6,683,344  
6,710,405B2  
6,710,463  
6,727,585  
6,759,692  
6771478B2  
7,005,734B2  
7,063,975B2  
7,071,537  

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