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IS61LPS25632A-200TQLI PDF预览

IS61LPS25632A-200TQLI

更新时间: 2024-11-13 18:07:39
品牌 Logo 应用领域
美国芯成 - ISSI 时钟静态存储器内存集成电路
页数 文件大小 规格书
35页 576K
描述
Cache SRAM, 256KX32, 3.1ns, CMOS, PQFP100, LEAD FREE, TQFP-100

IS61LPS25632A-200TQLI 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFP
包装说明:LQFP, QFP100,.63X.87针数:100
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.64
最长访问时间:3.1 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):200 MHzI/O 类型:COMMON
JESD-30 代码:R-PQFP-G100JESD-609代码:e3
长度:20 mm内存密度:8388608 bit
内存集成电路类型:CACHE SRAM内存宽度:32
湿度敏感等级:3功能数量:1
端子数量:100字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX32输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP100,.63X.87封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:2.5/3.3,3.3 V
认证状态:Not Qualified座面最大高度:1.6 mm
最小待机电流:3.14 V子类别:SRAMs
最大供电电压 (Vsup):3.465 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
处于峰值回流温度下的最长时间:10宽度:14 mm
Base Number Matches:1

IS61LPS25632A-200TQLI 数据手册

 浏览型号IS61LPS25632A-200TQLI的Datasheet PDF文件第2页浏览型号IS61LPS25632A-200TQLI的Datasheet PDF文件第3页浏览型号IS61LPS25632A-200TQLI的Datasheet PDF文件第4页浏览型号IS61LPS25632A-200TQLI的Datasheet PDF文件第5页浏览型号IS61LPS25632A-200TQLI的Datasheet PDF文件第6页浏览型号IS61LPS25632A-200TQLI的Datasheet PDF文件第7页 
IS61LPS51218A, IS61LPS25636A, IS61LPS25632A, IS64LPS25636A,  
IS61VPS51218A, IS61VPS25636A  
256K x 36, 256K x 32, 512K x 18  
9 Mb SYNCHRONOUS PIPELINED,  
SINgLE CYCLE DESELECT STATIC RAM  
JANUARY 2014  
FEATURES  
DESCRIPTION  
Theꢀ ISSIꢀ IS61LPS/VPS25636A,ꢀ IS61LPS25632A,ꢀ  
IS64LPS25636Aꢀ andꢀ IS61LPS/VPS51218Aꢀ areꢀ high-  
speed,ꢀ low-powerꢀ synchronousꢀ staticꢀ RAMs designed  
to provide burstable, high-performance memory for com-  
municationꢀandꢀnetworkingꢀapplications.ꢀTheꢀIS61LPS/  
VPS25636Aꢀ andꢀ IS64LPS25636Aꢀ areꢀ organizedꢀ asꢀ  
262,144ꢀ wordsꢀ byꢀ 36ꢀ bits.ꢀ ꢀ Theꢀ IS61LPS25632Aꢀ is  
organizedꢀasꢀ262,144ꢀwordsꢀbyꢀ32ꢀbits.ꢀTheꢀIS61LPS/  
VPS51218Aꢀisꢀorganizedꢀasꢀ524,288ꢀwordsꢀbyꢀ18ꢀbits.ꢀ  
Fabricatedꢀ withꢀ ISSI'sꢀ advancedꢀ CMOSꢀ technology,ꢀ  
theꢀdeviceꢀintegratesꢀaꢀ2-bitꢀburstꢀcounter,ꢀhigh-speedꢀ  
SRAMcore,andhigh-drivecapabilityoutputsintoasingleꢀ  
monolithic circuit. All synchronous inputs pass through  
registersꢀcontrolledꢀbyꢀaꢀpositive-edge-triggeredꢀsingleꢀ  
clock input.  
•ꢀ Internalꢀself-timedꢀwriteꢀcycle  
•ꢀ IndividualꢀByteꢀWriteꢀControlꢀandꢀGlobalꢀWrite  
•ꢀ Clockꢀcontrolled,ꢀregisteredꢀaddress,ꢀdataꢀandꢀ  
control  
•ꢀ BurstꢀsequenceꢀcontrolꢀusingꢀMODEꢀinputꢀꢀ  
•ꢀ Threeꢀchipꢀenableꢀoptionꢀforꢀsimpleꢀdepthꢀex-  
pansion and address pipelining  
•ꢀ Commonꢀdataꢀinputsꢀandꢀdataꢀoutputs  
•ꢀ AutoꢀPower-downꢀduringꢀdeselect  
•ꢀ Singleꢀcycleꢀdeselect  
•ꢀ SnoozeꢀMODEꢀforꢀreduced-powerꢀstandby  
•ꢀ JTAGꢀBoundaryꢀScanꢀforꢀBGAꢀpackage  
•ꢀ PowerꢀSupply  
Writeꢀcyclesꢀareꢀinternallyꢀself-timedꢀandꢀareꢀinitiatedꢀbyꢀ  
theꢀrisingꢀedgeꢀofꢀtheꢀclockꢀinput.ꢀWriteꢀcyclesꢀcanꢀbeꢀ  
one to four bytes wide as controlled by the write control  
inputs.  
ꢀ LPS:ꢀVdd 3.3V + 5%, Vddq 3.3V/2.5V + 5%  
VPS:ꢀVdd 2.5V + 5%, Vddq 2.5V + 5%  
Separatebyteenablesallowindividualbytestobewritten.  
Theꢀbyteꢀwriteꢀoperationꢀisꢀperformedꢀbyꢀusingꢀtheꢀbyteꢀ  
write enable (BWE) input combined with one or more  
individual byte write signals (BWx). Inꢀaddition,ꢀGlobalꢀ  
Writeꢀ(GW) is available for writing all bytes at one time,  
regardless of the byte write controls.  
•ꢀ JEDECꢀ100-PinꢀQFP,ꢀ119-ballꢀBGA,ꢀandꢀ165-  
ballꢀBGAꢀpackages  
•ꢀ Lead-freeꢀavailable  
BurstscanbeinitiatedwitheitherADSP (Address Status  
Processor)ꢀorꢀADSC (Address Status Cache Controller)  
inputꢀpins.ꢀSubsequentꢀburstꢀaddressesꢀcanꢀbeꢀgener-  
ated internally and controlled by the ADV (burst address  
advance) input pin.  
Theꢀmodeꢀpinꢀisꢀusedꢀtoꢀselectꢀtheꢀburstꢀsequenceꢀor-  
der,ꢀLinearꢀburstꢀisꢀachievedꢀwhenꢀthisꢀpinꢀisꢀtiedꢀLOW.ꢀ  
InterleaveꢀburstꢀisꢀachievedꢀwhenꢀthisꢀpinꢀisꢀtiedꢀHIGHꢀ  
or left floating.  
FAST ACCESS TIME  
Symbol  
Parameter  
250  
2.6ꢀ  
4ꢀ  
200  
3.1ꢀ  
5ꢀ  
166  
3.5ꢀ  
6ꢀ  
Units  
ns  
tkq  
tkc  
ClockꢀAccessꢀTimeꢀ  
CycleꢀTimeꢀ  
ns  
Frequencyꢀ  
250ꢀ  
200ꢀ  
166ꢀ  
MHz  
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no  
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on  
any published information and before placing orders for products.  
Integrated Silicon Solution, Inc.  
1
Rev. M  
01/14/14  

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