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IRLSL3036PBF PDF预览

IRLSL3036PBF

更新时间: 2024-11-20 05:39:31
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
10页 356K
描述
HEXFET Power MOSFET

IRLSL3036PBF 技术参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:LEAD FREE, TO-262, 3 PINReach Compliance Code:compliant
ECCN代码:EAR99风险等级:7.94
Is Samacsys:N雪崩能效等级(Eas):290 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):270 A
最大漏极电流 (ID):270 A最大漏源导通电阻:0.0024 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-262AA
JESD-30 代码:R-PSIP-T3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):380 W最大脉冲漏极电流 (IDM):1100 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRLSL3036PBF 数据手册

 浏览型号IRLSL3036PBF的Datasheet PDF文件第2页浏览型号IRLSL3036PBF的Datasheet PDF文件第3页浏览型号IRLSL3036PBF的Datasheet PDF文件第4页浏览型号IRLSL3036PBF的Datasheet PDF文件第5页浏览型号IRLSL3036PBF的Datasheet PDF文件第6页浏览型号IRLSL3036PBF的Datasheet PDF文件第7页 
PD -97358  
IRLS3036PbF  
IRLSL3036PbF  
HEXFET® Power MOSFET  
Applications  
D
S
l DC Motor Drive  
VDSS  
RDS(on) typ.  
max.  
ID (Silicon Limited)  
ID (Package Limited)  
60V  
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
1.9mΩ  
2.4m  
270A  
G
195A  
Benefits  
l Optimized for Logic Level Drive  
l Very Low RDS(ON) at 4.5V VGS  
l Superior R*Q at 4.5V VGS  
l Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
l Fully Characterized Capacitance and Avalanche  
SOA  
l Enhanced body diode dV/dt and dI/dt Capability  
l Lead-Free  
S
D
S
D
G
D2Pak  
G
TO-262  
IRLSL3036PbF  
IRLS3036PbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
270  
190  
195  
1100  
380  
2.5  
Units  
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
A
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
PD @TC = 25°C  
W
Maximum Power Dissipation  
Linear Derating Factor  
W/°C  
V
VGS  
±16  
8.0  
Gate-to-Source Voltage  
Peak Diode Recovery  
dv/dt  
TJ  
V/ns  
Operating Junction and  
-55 to + 175  
300  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
°C  
Avalanche Characteristics  
Single Pulse Avalanche Energy  
EAS (Thermally limited)  
290  
mJ  
A
Avalanche Current  
IAR  
See Fig. 14, 15, 22a, 22b  
Repetitive Avalanche Energy  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.40  
40  
Units  
°C/W  
11  
Rθ  
JC  
Junction-to-Case  
Rθ  
JA  
–––  
Junction-to-Ambient (PCB Mount, steady state)  
www.irf.com  
1
12/08/08  

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