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IRHNA593160 PDF预览

IRHNA593160

更新时间: 2024-11-09 04:23:11
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 130K
描述
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (SMD-2)

IRHNA593160 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:HERMETIC SEALED, CERAMIC, SMD-2, 3 PINReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.31
雪崩能效等级(Eas):440 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):52 A最大漏极电流 (ID):52 A
最大漏源导通电阻:0.049 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-CBCC-N3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):300 W
最大脉冲漏极电流 (IDM):208 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRHNA593160 数据手册

 浏览型号IRHNA593160的Datasheet PDF文件第2页浏览型号IRHNA593160的Datasheet PDF文件第3页浏览型号IRHNA593160的Datasheet PDF文件第4页浏览型号IRHNA593160的Datasheet PDF文件第5页浏览型号IRHNA593160的Datasheet PDF文件第6页浏览型号IRHNA593160的Datasheet PDF文件第7页 
                                                                          
PD-94493A  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (SMD-2)  
IRHNA597160  
1050V, P-CHANNEL  
TECHNOLOGY  
™
Product Summary  
Part Number  
Radiation Level Rds(on)  
ID  
0.049Ω  
0.049Ω  
IRHNA597160 100K Rads (Si)  
IRHNA593160 300K Rads (Si)  
-47A  
-47A  
SMD-2  
International Rectifier’s R5TM technology provides high  
performance power MOSFETs for space applications.  
These devices have been characterized for Single Event  
Effects (SEE) with useful performance up to an LET of  
80 (MeV/(mg/cm2)). The combination of low RDS(on) and  
low gate charge reduces the power losses in switching  
applications such as DC to DC converters and motor  
control. These devices retain all of the well established  
advantages of MOSFETs such as voltage control, fast  
switching, ease of paralleling and temperature stability  
of electrical parameters.  
Features:  
n
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Ultra Low RDS(on)  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Surface Mount  
Ceramic Package  
Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= -12V, T = 25°C Continuous Drain Current  
-47  
D
D
GS  
GS  
C
A
I
= -12V, T =100°C Continuous Drain Current  
-30  
-188  
250  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
DM  
@ T = 25°C  
P
W
W/°C  
V
D
C
2.0  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
±20  
GS  
E
400  
mJ  
A
AS  
I
-47  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
25  
mJ  
V/ns  
AR  
dv/dt  
-10  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Pckg. Mounting Surface Temp.  
Weight  
300 ( for 5s )  
3.3 ( Typical )  
For footnotes refer to the last page  
www.irf.com  
1
03/16/06  

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