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IRF7328 PDF预览

IRF7328

更新时间: 2024-11-17 22:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 109K
描述
HEXFET Power MOSFET

IRF7328 数据手册

 浏览型号IRF7328的Datasheet PDF文件第2页浏览型号IRF7328的Datasheet PDF文件第3页浏览型号IRF7328的Datasheet PDF文件第4页浏览型号IRF7328的Datasheet PDF文件第5页浏览型号IRF7328的Datasheet PDF文件第6页浏览型号IRF7328的Datasheet PDF文件第7页 
PD -94000  
IRF7328  
HEXFET® Power MOSFET  
Trench Technology  
VDSS  
-30V  
RDS(on) max  
21m@VGS = -10V  
32m@VGS = -4.5V  
ID  
-8.0A  
Ultra Low On-Resistance  
Dual P-Channel MOSFET  
Available in Tape & Reel  
-6.8A  
Description  
1
2
8
New trench HEXFET® Power MOSFETs from  
International Rectifier utilize advanced processing  
techniques to achieve extremely low on-resistance  
per silicon area. This benefit, combined with the  
ruggedized device design that HEXFET power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in battery and load management applications.  
S1  
G 1  
D1  
7
D 1  
3
4
6
S2  
D2  
5
G 2  
D 2  
SO-8  
Top V iew  
Absolute Maximum Ratings  
Parameter  
Drain-Source Voltage  
Max.  
-30  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current  
-8.0  
-6.4  
A
-32  
PD @TA = 25°C  
PD @TA = 70°C  
Maximum Power Dissipationƒ  
Maximum Power Dissipationƒ  
Linear Derating Factor  
2.0  
W
W
1.3  
16  
mW/°C  
V
VGS  
Gate-to-Source Voltage  
± 20  
TJ , TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient ƒ  
62.5  
°C/W  
www.irf.com  
1
10/04/00  

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