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IRF7331PBF_08 PDF预览

IRF7331PBF_08

更新时间: 2024-11-13 12:30:23
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 220K
描述
Ultra Low On-Resistance Dual N-Channel MOSFET

IRF7331PBF_08 数据手册

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PD - 95266A  
IRF7331PbF  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l Dual N-Channel MOSFET  
l Surface Mount  
l Available in Tape & Reel  
l Lead-Free  
VDSS  
20V  
RDS(on) max (mW)  
30@VGS = 4.5V  
ID  
7.0A  
45@VGS = 2.5V  
5.6A  
Description  
1
8
S1  
D1  
These N-Channel HEXFET® power MOSFETs from  
International Rectifier utilize advanced processing  
techniquestoachievetheextremelylowon-resistance  
per silicon area. This benefit provides the designer  
with an extremely efficient device for use in battery  
and load management applications.  
2
7
G1  
S2  
D1  
3
4
6
D2  
5
G2  
D2  
Top View  
SO-8  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of  
powerapplications. Withtheseimprovements,multiple  
devicescanbeusedinanapplicationwithdramatically  
reduced board space. The package is designed for  
vapor phase, infrared, or wave soldering techniques.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VDS  
Drain- Source Voltage  
20  
V
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ 4.5V  
Continuous Drain Current, VGS @ 4.5V  
Pulsed Drain Current   
7.0  
5.5  
A
28  
2.0  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation ƒ  
Power Dissipationƒ  
W
1.3  
Linear Derating Factor  
16  
mW/°C  
VGS  
Gate-to-Source Voltage  
± 12  
V
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Symbol  
RθJL  
Parameter  
Junction-to-Drain Lead  
Typ.  
–––  
Max.  
42  
Units  
RθJA  
Junction-to-Ambient ƒ  
–––  
62.5  
°C/W  
www.irf.com  
1
07/09/08  

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