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IRF610B PDF预览

IRF610B

更新时间: 2024-11-19 22:31:31
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
10页 868K
描述
200V N-Channel MOSFET

IRF610B 数据手册

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IRF610B/IRFS610B  
200V N-Channel MOSFET  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switching DC/DC converters,  
switch mode power supplies, DC-AC converters for  
uninterrupted power supply and motor control.  
3.3A, 200V, R  
= 1.5@V = 10 V  
DS(on) GS  
Low gate charge ( typical 7.2 nC)  
Low Crss ( typical 6.8 pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
G
TO-220  
IRF Series  
TO-220F  
IRFS Series  
G
D S  
G D  
S
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
IRF610B  
IRFS610B  
Units  
V
V
I
Drain-Source Voltage  
200  
DSS  
- Continuous (T = 25°C)  
Drain Current  
3.3  
2.1  
10  
3.3 *  
2.1 *  
10 *  
A
D
C
- Continuous (T = 100°C)  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
A
DM  
V
E
I
Gate-Source Voltage  
± 30  
40  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
3.3  
3.8  
5.5  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
W
AR  
dv/dt  
P
Power Dissipation (T = 25°C)  
38  
22  
D
C
- Derate above 25°C  
Operating and Storage Temperature Range  
0.31  
0.18  
W/°C  
°C  
T , T  
-55 to +150  
300  
J
STG  
Maximum lead temperature for soldering purposes,  
T
°C  
L
1/8" from case for 5 seconds  
* Drain current limited by maximum junction temperature.  
Thermal Characteristics  
Symbol  
Parameter  
IRF610B  
IRFS610B  
5.71  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case Max.  
Thermal Resistance, Case-to-Sink Typ.  
3.28  
0.5  
θJC  
--  
θCS  
Thermal Resistance, Junction-to-Ambient Max.  
62.5  
62.5  
θJA  
©2002 Fairchild Semiconductor Corporation  
Rev. A1, December 2002  

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