Datasheet > IRF5305S

IRF5305S

更新时间： 2024-10-30 12:23:47

品牌	Logo	应用领域
飞思卡尔 - FREESCALE		/
页数	文件大小	规格书
9页	349K
描述
HEXFETÂ® Power MOSFET

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IRF5305S 数据手册

IRF5305S/L

HEXFET^®Power MOSFET

^lAdvanced Process Technology

l Surface Mount (IRF5305S)

l Low-profile through-hole (IRF5305L)

l 175°C Operating Temperature

l Fast Switching

^lP-Channel

l Fully Avalanche Rated

Description

V_DSS= -55V

R_DS(on)= 0.06Ω

I_D= -31A

Fifth Generation HEXFETs from International Rectifier

utilize advanced processing techniques to achieve

extremely low on-resistance per silicon area. This

benefit, combined with the fast switching speed and

ruggedizeddevicedesignthatHEXFETPowerMOSFETs

arewellknownfor,providesthedesignerwithanextremely

efficient and reliable device for use in a wide variety of

applications.

The D²Pak is a surface mount power package capable of

accommodating die sizes up to HEX-4. It provides the

highest power capability and the lowest possible on-

resistance in any existing surface mount package. The

D²Pak is suitable for high current applications because of

its low internal connection resistance and can dissipate

up to 2.0W in a typical surface mount application.

The through-hole version (IRF5305L) is available for low-

profileapplications.

T O -262

Pak

Absolute Maximum Ratings

Parameter

Max.

-31

Units

I_D@ T_C= 25°C

I_D@ T_C= 100°C

I_DM

Continuous Drain Current, V_GS@ -10Vꢀ

Pulsed Drain Current ꢀ

-22

-110

3.8

P_D@T_A= 25°C

P_D@T_C= 25°C

Power Dissipation

110

0.71

± 20

280

-16

Linear Derating Factor

W/°C

V_GS

E_AS

I_AR

Gate-to-Source Voltage

Single Pulse Avalanche Energyꢀ

Avalanche Current

E_AR

dv/dt

T_J

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt ꢀ

Operating Junction and

V/ns

-5.8

-55 to + 175

T_STG

Storage Temperature Range

Soldering Temperature, for 10 seconds

°C

300 (1.6mm from case )

Thermal Resistance

Parameter

Junction-to-Case

Typ.

–––

Max.

1.4

Units

R_θJC

R_θJA

°C/W

Junction-to-Ambient ( PCB Mounted,steady-state)**

4/1/99

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