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IRF530L PDF预览

IRF530L

更新时间: 2024-10-31 22:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关局域网
页数 文件大小 规格书
10页 180K
描述
Power MOSFET(Vdss=100V, Rds(on)=0.11ohm, Id=17A)

IRF530L 数据手册

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PD - 91352A  
IRF530NS/L  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Surface Mount (IRF530NS)  
l Low-profile through-hole (IRF530NL)  
l 175°C Operating Temperature  
l Fast Switching  
D
VDSS =100V  
RDS(on) = 0.11Ω  
G
l Fully Avalanche Rated  
ID = 17A  
S
Description  
FifthGenerationHEXFETsfromInternationalRectifierutilizeadvancedprocessing  
techniques to achieve extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and ruggedized device design  
that HEXFET Power MOSFETs are well known for, provides the designer with  
an extremely efficient and reliable device for use in a wide variety of applications.  
The D2Pak is a surface mount power package capable of accommodating die  
sizes up to HEX-4. It provides the highest power capability and the lowest  
possible on-resistance in any existing surface mount package. The D2Pak is  
suitable for high current applications because of its low internal connection  
resistance and can dissipate up to 2.0W in a typical surface mount application.  
The through-hole version (IRF530NL) is available for low-profile applications.  
2
T O -26 2  
D
Pak  
Absolute Maximum Ratings  
Parameter  
Continuous Drain Current, VGS @ 10Vꢀ  
Continuous Drain Current, VGS @ 10Vꢀ  
Pulsed Drain Current ꢀ  
Max.  
17  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
12  
A
60  
PD @TA = 25°C  
PD @TC = 25°C  
Power Dissipation  
3.8  
W
W
Power Dissipation  
79  
Linear Derating Factor  
0.53  
W/°C  
V
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
Single Pulse Avalanche Energy‚ꢀ  
Avalanche Current•9.0  
150  
mJ  
A
7.9  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒꢀ  
Operating Junction and  
mJ  
5.0  
V/ns  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
1.9  
Units  
RθJC  
°C/W  
RθJA  
Junction-to-Ambient ( PCB Mounted,steady-state)**  
–––  
40  
www.irf.com  
1
5/13/98  

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