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IPB60R230P6

更新时间： 2024-11-07 01:02:59
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
1页 33K
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Material Content Data Sheet

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中文翻译

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IPB60R230P6 数据手册

  
Material Content Data Sheet  
Sales Product Name IPB60R230P6  
Issued  
27. August 2015  
1563.46 mg  
MA#  
MA001393638  
PG-TO263-3-2  
Package  
Weight*  
Average  
Mass  
[%]  
Average  
CAS#  
Weight  
[mg]  
Sum  
Mass  
[%]  
Sum  
Construction Element  
Material Group  
Substances  
[ppm]  
if applicable  
[ppm]  
chip  
inorganic material  
non noble metal  
inorganic material  
non noble metal  
non noble metal  
organic material  
plastics  
silicon  
7440-21-3  
7439-89-6  
7723-14-0  
7440-50-8  
7429-90-5  
1333-86-4  
-
6.823  
0.304  
0.44  
0.02  
0.01  
19.45  
1.75  
0.63  
6.98  
34.70  
0.63  
0.01  
0.00  
0.01  
0.01  
0.30  
0.04  
0.01  
35.01  
0.44  
4364  
195  
4364  
leadframe  
iron  
phosphorus  
copper  
0.091  
58  
304.026  
27.297  
9.924  
19.48  
1.75  
194457  
17460  
6347  
69821  
346987  
6254  
146  
194710  
17460  
wire  
aluminium  
carbon black  
epoxy resin  
silicondioxide  
tin  
encapsulation  
109.162  
542.502  
9.777  
inorganic material  
non noble metal  
non noble metal  
inorganic material  
noble metal  
60676-86-0  
7440-31-5  
7440-02-0  
7723-14-0  
7440-22-4  
7440-31-5  
7439-92-1  
7439-89-6  
7723-14-0  
7440-50-8  
42.31  
0.63  
423155  
6254  
leadfinish  
plating  
nickel  
0.228  
phosphorus  
silver  
0.001  
0.01  
0.32  
1
146  
solder  
0.124  
79  
non noble metal  
non noble metal  
non noble metal  
inorganic material  
non noble metal  
< 10%  
tin  
0.099  
63  
lead  
4.726  
3023  
351  
3165  
heatspreader  
*deviation  
iron  
0.548  
phosphorus  
copper  
0.165  
105  
547.666  
35.06  
350289  
350746  
Sum in total: 100.00  
1000000  
Important Remarks:  
1.  
2.  
3.  
Infineon Technologies AG provides full material declaration based on information provided by third parties and  
has taken and continues to take reasonable steps to provide representative and accurate information.  
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be  
proprietary, and thus CAS numbers and other limited information may not be available for release.  
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any  
time due to technical requirements and development without notification.  
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption  
7a, Lead in high melting temperature type solders.  
Company  
Address  
Internet  
Infineon Technologies AG  
81726 München  
www.infineon.com  
1

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