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IPB60R190P6 PDF预览

IPB60R190P6

更新时间： 2024-11-07 01:02:59
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
1页 33K
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Material Content Data Sheet

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IPB60R190P6 数据手册

  
Material Content Data Sheet  
Sales Product Name IPB60R160P6  
Issued  
27. August 2015  
1565.10 mg  
MA#  
MA001393452  
PG-TO263-3-2  
Package  
Weight*  
Average  
Mass  
[%]  
Average  
CAS#  
Weight  
[mg]  
Sum  
Mass  
[%]  
Sum  
Construction Element  
Material Group  
Substances  
[ppm]  
if applicable  
[ppm]  
chip  
inorganic material  
non noble metal  
inorganic material  
non noble metal  
non noble metal  
organic material  
plastics  
silicon  
7440-21-3  
7439-89-6  
7723-14-0  
7440-50-8  
7429-90-5  
1333-86-4  
-
9.747  
0.304  
0.62  
0.02  
0.01  
19.43  
1.69  
0.63  
6.95  
34.56  
0.62  
0.01  
0.00  
0.01  
0.01  
0.39  
0.04  
0.01  
35.00  
0.62  
6228  
195  
6228  
leadframe  
iron  
phosphorus  
copper  
0.091  
58  
304.026  
26.409  
9.895  
19.46  
1.69  
194253  
16874  
6323  
69548  
345632  
6247  
146  
194506  
16874  
wire  
aluminium  
carbon black  
epoxy resin  
silicondioxide  
tin  
encapsulation  
108.849  
540.949  
9.777  
inorganic material  
non noble metal  
non noble metal  
inorganic material  
noble metal  
60676-86-0  
7440-31-5  
7440-02-0  
7723-14-0  
7440-22-4  
7440-31-5  
7439-92-1  
7439-89-6  
7723-14-0  
7440-50-8  
42.14  
0.62  
421503  
6247  
leadfinish  
plating  
nickel  
0.228  
phosphorus  
silver  
0.001  
0.01  
0.41  
1
146  
solder  
0.161  
103  
non noble metal  
non noble metal  
non noble metal  
inorganic material  
non noble metal  
< 10%  
tin  
0.129  
82  
lead  
6.156  
3933  
350  
4118  
heatspreader  
*deviation  
iron  
0.548  
phosphorus  
copper  
0.165  
105  
547.666  
35.05  
349922  
350378  
Sum in total: 100.00  
1000000  
Important Remarks:  
1.  
2.  
3.  
Infineon Technologies AG provides full material declaration based on information provided by third parties and  
has taken and continues to take reasonable steps to provide representative and accurate information.  
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be  
proprietary, and thus CAS numbers and other limited information may not be available for release.  
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any  
time due to technical requirements and development without notification.  
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption  
7a, Lead in high melting temperature type solders.  
Company  
Address  
Internet  
Infineon Technologies AG  
81726 München  
www.infineon.com  
1

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