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date 09/07/2017
page 1 of 5
SERIES: HSE-B20X │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• placement pins for secure PCB attachment
• round hole for component attchment
• multiple available cut lengths
thermal resistance1
power
MODEL
dissipation1
length
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
(mm)
25
HSE-B20250-040H
HSE-B20270-040H
HSE-B20380-040H
HSE-B20500-040H
HSE-B20630-040H
15.00
12.50
10.14
8.43
19.57
17.29
13.19
11.17
11.54
4.28
3.64
3.94
4.85
3.73
3.44
2.82
2.44
3.17
2.31
5.00
6.00
7.40
8.90
9.60
27
38
50
63
7.81
Note:
1. See performance curves for full thermal resistance details.
2. Custom cut to length options available. Thermal data not available on custom lengths.
PERFORMANCE CURVES
HSE-B20250-040H
100
90
Without Airflow
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
200 LFM
400 LFM
80
Power
(W)
Natural
Conv.
200 LFM
400 LFM
70
60
50
40
30
20
0
1
0
0
0
19.57
35.77
49.68
62.71
74.79
85.46
97.48
108.09
117.16
127.50
4.28
3.44
2
8.76
6.98
3
13.06
17.44
21.93
26.39
30.77
35.20
39.64
43.98
10.36
13.88
17.35
20.74
24.33
27.77
31.31
34.86
4
5
6
7
10
0
8
9
0
1
2
3
4
5
6
7
8
9
10
10
Dissipated Power (W)
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
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