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date 05/02/2017
page 1 of 5
SERIES: HSE-B20X-01 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• placement pins for secure PCB attachment
• slide in style
• multiple available cut lengths
thermal resistance1
power
MODEL
dissipation1
length
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
(mm)
25
HSE-B20250-040H-01
HSE-B20380-040H-01
HSE-B20500-040H-01
HSE-B20630-040H-01
13.64
10.27
8.43
18.58
13.31
11.67
11.01
4.44
5.77
2.85
4.46
3.30
3.68
1.91
2.97
5.50
7.30
8.90
9.10
38
50
63
8.24
Note:
1. See performance curves for full thermal resistance details.
2. Custom cut to length options available. Thermal data not available on custom lengths.
PERFORMANCE CURVES
HSE-B20250-040H-01
100
90
Without Airflow
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
200 LFM
400 LFM
80
Power
(W)
Natural
Conv.
200 LFM
400 LFM
70
60
50
40
30
0
1
0
0
0
18.58
33.32
45.87
58.26
69.68
82.14
92.93
102.15
110.43
117.47
4.44
3.30
2
9.59
6.21
3
14.21
18.79
23.71
28.49
32.90
37.44
42.50
47.13
9.38
4
12.55
15.95
19.39
22.71
25.85
29.39
32.50
5
6
20
10
0
7
8
9
0
1
2
3
4
5
6
7
8
9
10
10
Dissipated Power (W)
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
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