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HSE-BX-04H-01 PDF预览

HSE-BX-04H-01

更新时间: 2024-10-02 01:07:27
品牌 Logo 应用领域
CUI /
页数 文件大小 规格书
5页 455K
描述
HEAT SINK

HSE-BX-04H-01 数据手册

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For more information, please visit the product page.  
date 05/08/2017  
page 1 of 5  
SERIES: HSE-BX-04H-01 DESCRIPTION: HEAT SINK  
FEATURES  
• TO-220 package  
• placement pins for secure PCB attachment  
• round hole for component attachment  
• multiple available cut lengths  
thermal resistance1  
power  
MODEL  
dissipation1  
length  
@ 75°C ΔT,  
nat conv  
(°C/W)  
@ 1 W,  
nat conv  
(°C/W)  
@ 1 W,  
200 LFM  
(°C/W)  
@ 1 W,  
400 LFM  
(°C/W)  
@ 75°C ΔT,  
nat conv  
(W)  
(mm)  
25  
HSE-B250-04H  
HSE-B500-04H  
HSE-B630-04H  
9.38  
6.15  
5.21  
13.60  
8.05  
9.37  
3.26  
2.88  
2.31  
2.25  
2.12  
1.86  
8.00  
12.20  
14.40  
50  
63  
Note:  
1. See performance curves for full thermal resistance details.  
2. Custom cut to length options available. Thermal data not available on custom lengths.  
PERFORMANCE CURVES  
HSE-B250-04H  
100  
90  
80  
70  
60  
50  
40  
30  
Without Airflow  
Heatsink Temperature Rise Above  
Ambient (ΔT = Ths - Ta) (°C)  
200 LFM  
400 LFM  
Power  
(W)  
Natural  
Conv.  
200 LFM  
400 LFM  
0
1
0
0
0
13.60  
24.62  
34.26  
43.45  
51.69  
60.18  
68.13  
75.33  
82.77  
90.41  
3.26  
2.25  
2
6.61  
4.65  
3
10.05  
13.46  
16.85  
20.16  
23.72  
27.06  
30.36  
34.06  
7.18  
4
9.67  
5
12.11  
14.49  
17.06  
19.37  
21.85  
24.45  
6
20  
10  
0
7
8
9
0
1
2
3
4
5
6
7
8
9
10  
10  
Dissipated Power (W)  
Ths: “hot spot” temperature measured on the heatsink  
Ta: ambient temperature  
cui.com  

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