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HSE-B254-045H PDF预览

HSE-B254-045H

更新时间: 2024-11-03 01:04:47
品牌 Logo 应用领域
CUI /
页数 文件大小 规格书
5页 467K
描述
HEAT SINK

HSE-B254-045H 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:unknown风险等级:5.54
Base Number Matches:1

HSE-B254-045H 数据手册

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For more information, please visit the product page.  
date 09/07/2017  
page 1 of 5  
SERIES: HSE-BX-045H DESCRIPTION: HEAT SINK  
FEATURES  
• TO-220 package  
• placement pins for secure PCB attachment  
• round hole for component attachment  
• multiple available cut lengths  
thermal resistance1  
power  
MODEL  
dissipation1  
length  
@ 75°C ΔT,  
nat conv  
(°C/W)  
@ 1 W,  
nat conv  
(°C/W)  
@ 1 W,  
200 LFM  
(°C/W)  
@ 1 W,  
400 LFM  
(°C/W)  
@ 75°C ΔT,  
nat conv  
(W)  
(mm)  
25.4  
38.1  
50.8  
63.5  
HSE-B254-045H  
HSE-B381-045H  
HSE-B508-045H  
HSE-B635-045H  
11.72  
7.58  
8.06  
6.41  
16.12  
8.52  
3.86  
2.63  
4.38  
3.53  
2.52  
1.82  
2.89  
2.49  
6.40  
9.90  
10.52  
7.99  
9.30  
11.70  
Note:  
1. See performance curves for full thermal resistance details.  
2. Custom cut to length options available. Thermal data not available on custom lengths.  
PERFORMANCE CURVES  
HSE-B254-045H  
100  
90  
Without Airflow  
Heatsink Temperature Rise Above  
Ambient (ΔT = Ths - Ta) (°C)  
200 LFM  
400 LFM  
80  
70  
60  
Power  
(W)  
Natural  
Conv.  
200 LFM  
400 LFM  
0
1
0
0
0
16.12  
29.41  
40.00  
51.44  
61.45  
72.61  
80.92  
90.03  
96.81  
105.60  
3.86  
2.52  
2
8.30  
5.68  
50  
40  
30  
20  
10  
0
3
12.22  
16.39  
20.66  
24.92  
28.68  
33.22  
37.23  
41.07  
9.31  
4
12.14  
15.34  
18.41  
20.86  
23.73  
26.92  
30.04  
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
10  
10  
Dissipated Power (W)  
Ths: “hot spot” temperature measured on the heatsink  
Ta: ambient temperature  
cui.com  

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