Datasheet > HSE-B500-04H

HSE-B500-04H

更新时间： 2024-02-29 15:00:51

品牌	Logo	应用领域
CUI		/
页数	文件大小	规格书
5页	455K
描述
HEAT SINK

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中文翻译

获取价格

数据手册

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HSE-B500-04H 数据手册

For more information, please visit the product page.

date 05/08/2017

page 1 of 5

SERIES: HSE-BX-04H-01 │ DESCRIPTION: HEAT SINK

FEATURES

• TO-220 package

• placement pins for secure PCB attachment

• round hole for component attachment

• multiple available cut lengths

thermal resistance¹

power

MODEL

dissipation¹

length

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

(mm)

HSE-B250-04H

HSE-B500-04H

HSE-B630-04H

9.38

6.15

5.21

13.60

8.05

9.37

3.26

2.88

2.31

2.25

2.12

1.86

8.00

12.20

14.40

Note:

1. See performance curves for full thermal resistance details.

2. Custom cut to length options available. Thermal data not available on custom lengths.

PERFORMANCE CURVES

HSE-B250-04H

100

Without Airflow

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

200 LFM

400 LFM

Power

(W)

Natural

Conv.

200 LFM

400 LFM

13.60

24.62

34.26

43.45

51.69

60.18

68.13

75.33

82.77

90.41

3.26

2.25

6.61

4.65

10.05

13.46

16.85

20.16

23.72

27.06

30.36

34.06

7.18

9.67

12.11

14.49

17.06

19.37

21.85

24.45

Dissipated Power (W)

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

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