Datasheet > HSE-B250-04H

HSE-B250-04H

更新时间： 2024-11-03 01:07:27

品牌	Logo	应用领域
CUI		/
页数	文件大小	规格书
5页	455K
描述
HEAT SINK

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

HSE-B250-04H 数据手册

For more information, please visit the product page.

date 05/08/2017

page 1 of 5

SERIES: HSE-BX-04H-01 │ DESCRIPTION: HEAT SINK

FEATURES

• TO-220 package

• placement pins for secure PCB attachment

• round hole for component attachment

• multiple available cut lengths

thermal resistance¹

power

MODEL

dissipation¹

length

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

(mm)

HSE-B250-04H

HSE-B500-04H

HSE-B630-04H

9.38

6.15

5.21

13.60

8.05

9.37

3.26

2.88

2.31

2.25

2.12

1.86

8.00

12.20

14.40

Note:

1. See performance curves for full thermal resistance details.

2. Custom cut to length options available. Thermal data not available on custom lengths.

PERFORMANCE CURVES

HSE-B250-04H

100

Without Airflow

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

200 LFM

400 LFM

Power

(W)

Natural

Conv.

200 LFM

400 LFM

13.60

24.62

34.26

43.45

51.69

60.18

68.13

75.33

82.77

90.41

3.26

2.25

6.61

4.65

10.05

13.46

16.85

20.16

23.72

27.06

30.36

34.06

7.18

9.67

12.11

14.49

17.06

19.37

21.85

24.45

Dissipated Power (W)

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

cui.com

12 3 4 5

中文翻译

下载PDF

与HSE-B250-04H相关器件

型号	品牌	获取价格	描述	数据表
HSE-B254-045H	CUI	获取价格	HEAT SINK
HSE-B254-04H	CUI	获取价格	Extruded Heat Sink, TO-220 / TO-218
HSEB3	MMD	获取价格	6.0mm x 3.5 mm x1.2mm Ceramic Package
HSE-B381-045H	CUI	获取价格	HEAT SINK
HSE-B381-04H	CUI	获取价格	HEAT SINK
HSE-B500-04H	CUI	获取价格	HEAT SINK
HSE-B508-045H	CUI	获取价格	HEAT SINK
HSE-B630-04H	CUI	获取价格	HEAT SINK
HSE-B635-045H	CUI	获取价格	HEAT SINK
HSE-BX-01	CUI	获取价格	HEAT SINK