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date 09/11/2017
page 1 of 5
SERIES: HSE-BX-02 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• placement pins for secure PCB attachment
• round hole for component attachment
• multiple available cut lengths
thermal resistance1
power
MODEL
dissipation1
length
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
(mm)
25.4
38.1
50.8
50.8
63.5
63.5
HSE-B20254-035H
HSE-B20381-035H
HSE-B20508-035H
HSE-B20508-035H-W2
HSE-B20635-035H
HSE-B20635-035H-W2
12.93
11.54
9.62
9.62
8.15
8.15
14.40
13.64
12.98
12.98
10.92
10.92
3.28
3.66
5.17
5.17
4.35
4.35
2.49
2.76
3.28
3.28
2.86
2.86
5.80
6.50
7.80
7.80
9.20
9.20
Note:
1. See performance curves for full thermal resistance details.
2. Placement pins with standoffs.
3. Custom cut to length options available. Thermal data not available on custom lengths.
PERFORMANCE CURVES
HSE-B20254-035H
100
90
Without Airflow
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
200 LFM
400 LFM
Power
(W)
Natural
Conv.
80
70
60
50
40
30
20
10
0
200 LFM
400 LFM
0
1
0
0
0
14.40
28.52
43.03
56.78
67.70
77.09
86.63
95.53
103.32
112.39
3.28
2.49
2
6.90
5.02
3
10.51
13.98
17.81
21.84
25.55
29.43
33.25
37.35
7.48
4
9.87
5
12.71
14.82
17.33
19.68
22.19
24.51
6
7
8
9
0
1
2
3
4
5
6
7
8
9
10
10
Dissipated Power (W)
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
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