Datasheet > HSE-B20381-035H

HSE-B20381-035H

更新时间： 2024-11-03 01:00:43

品牌	Logo	应用领域
CUI		/
页数	文件大小	规格书
5页	476K
描述
HEAT SINK

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中文翻译

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数据手册

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HSE-B20381-035H 数据手册

For more information, please visit the product page.

date 09/11/2017

page 1 of 5

SERIES: HSE-BX-02 │ DESCRIPTION: HEAT SINK

FEATURES

• TO-220 package

• placement pins for secure PCB attachment

• round hole for component attachment

• multiple available cut lengths

thermal resistance¹

power

MODEL

dissipation¹

length

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

(mm)

25.4

38.1

50.8

63.5

HSE-B20254-035H

HSE-B20381-035H

HSE-B20508-035H

HSE-B20508-035H-W²

HSE-B20635-035H

HSE-B20635-035H-W²

12.93

11.54

9.62

8.15

14.40

13.64

12.98

10.92

3.28

3.66

5.17

4.35

2.49

2.76

3.28

2.86

5.80

6.50

7.80

9.20

Note:

1. See performance curves for full thermal resistance details.

2. Placement pins with standoffs.

3. Custom cut to length options available. Thermal data not available on custom lengths.

PERFORMANCE CURVES

HSE-B20254-035H

100

Without Airflow

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

200 LFM

400 LFM

Power

(W)

Natural

Conv.

200 LFM

400 LFM

14.40

28.52

43.03

56.78

67.70

77.09

86.63

95.53

103.32

112.39

3.28

2.49

6.90

5.02

10.51

13.98

17.81

21.84

25.55

29.43

33.25

37.35

7.48

9.87

12.71

14.82

17.33

19.68

22.19

24.51

Dissipated Power (W)

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

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