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HSE-B20250-045H PDF预览

HSE-B20250-045H

更新时间: 2024-11-03 01:24:19
品牌 Logo 应用领域
CUI /
页数 文件大小 规格书
3页 294K
描述
HEAT SINK

HSE-B20250-045H 数据手册

 浏览型号HSE-B20250-045H的Datasheet PDF文件第2页浏览型号HSE-B20250-045H的Datasheet PDF文件第3页 
For more information, please visit the product page.  
date 05/11/2017  
page 1 of 3  
MODEL: HSE-B20250-045H DESCRIPTION: HEAT SINK  
FEATURES  
• TO-220 package  
• placement pins for secure PCB mounting  
• round hole for component attachment  
• black anodized finish  
thermal resistance1  
power  
MODEL  
dissipation1  
@ 75°C ΔT,  
nat conv  
(°C/W)  
@ 1 W,  
nat conv  
(°C/W)  
@ 1 W,  
200 LFM  
(°C/W)  
@ 1 W,  
400 LFM  
(°C/W)  
@ 75°C ΔT,  
nat conv  
(W)  
HSE-B20250-045H  
9.74  
12.29  
4.05  
2.84  
7.70  
Note:  
1. See performance curves for full thermal resistance details.  
PERFORMANCE CURVES  
100  
90  
Without Airflow  
Heatsink Temperature Rise Above  
Ambient (ΔT = Ths - Ta) (°C)  
200 LFM  
400 LFM  
80  
Power  
(W)  
Natural  
Conv.  
200 LFM  
400 LFM  
70  
0
1
0
0
0
12.29  
23.82  
34.26  
44.14  
53.47  
62.05  
70.15  
77.35  
84.60  
90.94  
4.05  
2.84  
60  
50  
40  
30  
20  
2
7.75  
6.41  
3
11.31  
15.68  
19.34  
22.49  
26.38  
30.60  
34.29  
37.71  
9.58  
4
12.55  
16.03  
18.96  
21.56  
25.15  
28.46  
31.61  
5
6
7
10  
0
8
9
0
1
2
3
4
5
6
7
8
9
10  
10  
Dissipated Power (W)  
Ths: “hot spot” temperature measured on the heatsink  
Ta: ambient temperature  
cui.com  

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