Datasheet > HMC462LP5_10

HMC462LP5_10

更新时间： 2022-11-07 16:45:12

品牌	Logo	应用领域
HITTITE		放大器
页数	文件大小	规格书
6页	669K
描述
GaAs pHEMT MMIC LOW NOISE AMPLIFIER, 2 - 20 GHz

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数据手册

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HMC462LP5_10 数据手册

HMC462LP5 / 462LP5E

v04.1010

GaAs pHEMT MMIC

LOW NOISE AMPLIFIER, 2 - 20 GHz

Outline Drawing

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.

PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED

LAND PATTERN.

Package Information

Part Number

Package Body Material

Lead Finish

MSL Rating

MSL1 ^[1]

Package Marking ^[3]

H462

XXXX

HMC462LP5

Low Stress Injection Molded Plastic

Sn/Pb Solder

H462

XXXX

MSL1 ^[2]

HMC462LP5E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

[1] Max peak reﬂow temperature of 235 °C

[2] Max peak reﬂow temperature of 260 °C

[3] 4-Digit lot number XXXX

For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

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