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HCF4009UBEY PDF预览

HCF4009UBEY

更新时间: 2024-11-04 03:24:39
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 转换器
页数 文件大小 规格书
8页 135K
描述
HEX BUFFER/CONVERTER (INVERTING)

HCF4009UBEY 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP, DIP16,.3
针数:16Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.56
其他特性:HIGH TO LOW LEVEL TRANSLATOR系列:4000/14000/40000
JESD-30 代码:R-PDIP-T16JESD-609代码:e3
负载电容(CL):50 pF逻辑集成电路类型:INVERTER
功能数量:6输入次数:1
端子数量:16最高工作温度:125 °C
最低工作温度:-55 °C输出特性:OPEN-DRAIN
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP16,.3封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):245
电源:3/15 VProp。Delay @ Nom-Sup:140 ns
传播延迟(tpd):140 ns认证状态:Not Qualified
施密特触发器:NO座面最大高度:5.1 mm
子类别:Gates最大供电电压 (Vsup):20 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:MOS
温度等级:MILITARY端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.62 mmBase Number Matches:1

HCF4009UBEY 数据手册

 浏览型号HCF4009UBEY的Datasheet PDF文件第2页浏览型号HCF4009UBEY的Datasheet PDF文件第3页浏览型号HCF4009UBEY的Datasheet PDF文件第4页浏览型号HCF4009UBEY的Datasheet PDF文件第5页浏览型号HCF4009UBEY的Datasheet PDF文件第6页浏览型号HCF4009UBEY的Datasheet PDF文件第7页 
HCF4009UB  
HEX BUFFER/CONVERTER (INVERTING)  
PROPAGATION DELAY TIME tPD = 40ns  
(TYP.) at VDD = 10V CL = 50pF  
HIGH TO LOW LEVEL LOGIC CONVERSION  
MULTIPLEXER: 1 TO 6 OR 6 TO 1  
HIGH "SINK" AND "SOURCE" CURRENT  
CAPABILITY  
DIP  
SOP  
QUIESCENT CURRENT SPECIFIED UP TO  
20V  
5V, 10V AND 15V PARAMETRIC RATINGS  
INPUT LEAKAGE CURRENT  
II = 100nA (MAX) AT VDD = 18V TA = 25°C  
ORDER CODES  
PACKAGE  
TUBE  
T & R  
DIP  
HCF4009UBEY  
HCF4009UBM1  
100% TESTED FOR QUIESCENT CURRENT  
SOP  
HCF4009UM013TR  
MEETS ALL REQUIREMENTS OF JEDEC  
JESD13B " STANDARD SPECIFICATIONS  
FOR DESCRIPTION OF B SERIES CMOS  
DEVICES"  
It is an inverting Hex Buffer/Converter and can be  
used as CMOS to TTL or DTL logic level  
converters as current "sink" ot "source" drivers or  
as multiplexer (1 to 6).  
It is a preferred replacement of HCF4049UB in  
buffer applications.  
DESCRIPTION  
The HCF4009UB is a monolithic integrated circuit  
fabricated in Metal Oxide Semiconductor  
technology available in DIP and SOP packages.  
PIN CONNECTION  
July 2002  
1/8  

HCF4009UBEY 替代型号

型号 品牌 替代类型 描述 数据表
CD4009UBME4 TI

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