是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | VFBGA, BGA90,9X15,32 |
针数: | 90 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.02 |
风险等级: | 5.84 | 访问模式: | FOUR BANK PAGE BURST |
其他特性: | AUTO/SELF REFRESH | 最大时钟频率 (fCLK): | 185 MHz |
I/O 类型: | COMMON | 交错的突发长度: | 2,4,8 |
JESD-30 代码: | R-PBGA-B90 | JESD-609代码: | e1 |
长度: | 13 mm | 内存密度: | 134217728 bit |
内存集成电路类型: | DDR DRAM | 内存宽度: | 32 |
功能数量: | 1 | 端口数量: | 1 |
端子数量: | 90 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
组织: | 4MX32 | 输出特性: | 3-STATE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA90,9X15,32 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 电源: | 1.8 V |
认证状态: | Not Qualified | 刷新周期: | 4096 |
座面最大高度: | 1 mm | 自我刷新: | YES |
连续突发长度: | 2,4,8 | 子类别: | DRAMs |
最大供电电压 (Vsup): | 1.95 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
宽度: | 8 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
H5MS1222EFP-Q3M | HYNIX |
获取价格 |
128Mbit MOBILE DDR SDRAM based on 1M x 4Bank x32 I/O | |
H5MS1262EFP-J3E | HYNIX |
获取价格 |
128M (8Mx16bit) Mobile DDR SDRAM | |
H5MS1262EFP-J3M | HYNIX |
获取价格 |
128M (8Mx16bit) Mobile DDR SDRAM | |
H5MS1262EFP-K3E | HYNIX |
获取价格 |
128M (8Mx16bit) Mobile DDR SDRAM | |
H5MS1262EFP-K3M | HYNIX |
获取价格 |
128M (8Mx16bit) Mobile DDR SDRAM | |
H5MS1262EFP-L3E | HYNIX |
获取价格 |
128M (8Mx16bit) Mobile DDR SDRAM | |
H5MS1262EFP-L3M | HYNIX |
获取价格 |
128M (8Mx16bit) Mobile DDR SDRAM | |
H5MS1G22MFP-E3M | HYNIX |
获取价格 |
1Gbit MOBILE DDR SDRAM based on 8M x 4Bank x32 I/O | |
H5MS1G22MFP-J3M | HYNIX |
获取价格 |
1Gbit MOBILE DDR SDRAM based on 8M x 4Bank x32 I/O | |
H5MS1G22MFP-K3M | HYNIX |
获取价格 |
1Gbit MOBILE DDR SDRAM based on 8M x 4Bank x32 I/O |