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FQPF9N30 PDF预览

FQPF9N30

更新时间: 2024-11-24 22:26:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 663K
描述
300V N-Channel MOSFET

FQPF9N30 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-220F包装说明:TO-220F, 3 PIN
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.24
Is Samacsys:N雪崩能效等级(Eas):420 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:300 V最大漏极电流 (Abs) (ID):6 A
最大漏极电流 (ID):6 A最大漏源导通电阻:0.45 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT APPLICABLE极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):42 W最大脉冲漏极电流 (IDM):24 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT APPLICABLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FQPF9N30 数据手册

 浏览型号FQPF9N30的Datasheet PDF文件第2页浏览型号FQPF9N30的Datasheet PDF文件第3页浏览型号FQPF9N30的Datasheet PDF文件第4页浏览型号FQPF9N30的Datasheet PDF文件第5页浏览型号FQPF9N30的Datasheet PDF文件第6页浏览型号FQPF9N30的Datasheet PDF文件第7页 
May 2000  
TM  
QFET  
FQPF9N30  
300V N-Channel MOSFET  
General Description  
Features  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switching DC/DC converters,  
switch mode power supply.  
6.0A, 300V, R  
= 0.45@V = 10 V  
DS(on) GS  
Low gate charge ( typical 17 nC)  
Low Crss ( typical 16 pF)  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
!
"
! "  
"
G !  
"
G D  
S
TO-220F  
FQPF Series  
!
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQPF9N30  
300  
Units  
V
V
I
Drain-Source Voltage  
DSS  
- Continuous (T = 25°C)  
Drain Current  
6.0  
A
D
C
- Continuous (T = 100°C)  
3.8  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
24  
A
DM  
V
E
I
Gate-Source Voltage  
± 30  
420  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
6.0  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
4.2  
mJ  
V/ns  
W
AR  
dv/dt  
4.5  
P
Power Dissipation (T = 25°C)  
42  
D
C
- Derate above 25°C  
Operating and Storage Temperature Range  
0.34  
-55 to +150  
W/°C  
°C  
T , T  
J
STG  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
--  
Max  
2.98  
62.5  
Units  
°C/W  
°C/W  
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
θJC  
θJA  
--  
©2000 Fairchild Semiconductor International  
Rev. A, May 2000  

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