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FQD5P20_08 PDF预览

FQD5P20_08

更新时间: 2024-01-17 00:09:55
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飞兆/仙童 - FAIRCHILD /
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9页 663K
描述
200V P-Channel MOSFET

FQD5P20_08 数据手册

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October 2008  
QFET®  
FQD5P20 / FQU5P20  
200V P-Channel MOSFET  
Features  
General Description  
-3.7A, -200V, R  
= 1.4@V = -10 V  
DS(on) GS  
These P-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary,  
planar stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the  
avalanche and commutation mode. These devices are well  
suited for high efficiency switching DC/DC converters.  
Low gate charge ( typical 10 nC)  
Low Crss ( typical 12 pF)  
Fast switching  
100% avalanche tested  
RoHS Compliant  
S
!
D
G!  
I-PAK  
FQU Series  
D-PAK  
FQD Series  
G
S
G
D
S
!
D
Absolute Maximum Ratings  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
FQD5P20 / FQU5P20  
Units  
V
V
I
Drain-Source Voltage  
-200  
-3.7  
DSS  
- Continuous (T = 25°C)  
Drain Current  
A
D
C
- Continuous (T = 100°C)  
-2.34  
-14.8  
± 30  
A
C
I
(Note 1)  
Drain Current  
- Pulsed  
A
DM  
V
E
I
Gate-Source Voltage  
V
GSS  
AS  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
Single Pulsed Avalanche Energy  
Avalanche Current  
330  
mJ  
A
-3.7  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
4.5  
mJ  
V/ns  
W
AR  
dv/dt  
-5.5  
Power Dissipation (T = 25°C) *  
2.5  
P
A
D
Power Dissipation (T = 25°C)  
45  
W
C
- Derate above 25°C  
Operating and Storage Temperature Range  
0.36  
W/°C  
°C  
T , T  
-55 to +150  
J
STG  
Maximum lead temperature for soldering purposes,  
T
300  
°C  
L
1/8" from case for 5 seconds  
Thermal Characteristics  
Symbol  
Parameter  
Typ  
--  
Max  
2.78  
50  
Units  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient *  
Thermal Resistance, Junction-to-Ambient  
θJC  
θJA  
θJA  
--  
--  
110  
* When mounted on the minimum pad size recommended (PCB Mount)  
©2008 Fairchild Semiconductor Internationa  
Rev. A1, October 2008  

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