Typical Characteristics TJ = 25 °C unless otherwise noted
10
10000
1000
100
Ciss
VDD = 20 V
ID = 18 A
8
VDD = 30 V
Coss
6
VDD = 40 V
4
2
0
Crss
f = 1 MHz
GS = 0 V
V
10
0.1
0
10
20
30
40
50
60
70
1
10
60
VDS, DRAIN TO SOURCE VOLTAGE (V)
Qg, GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics
Figure8. C a p a c i t a n c e v s D r a i n
to Source Voltage
20
15
10
5
30
10
RθJA = 50 oC/W
TJ = 25 o
C
VGS = 10 V
TJ = 100 oC
VGS = 8 V
TJ = 125 o
C
0
1
25
50
75
100
125
150
0.01
0.1
1
10
100 300
TA, AMBIENT TEMPERATURE (oC)
tAV, TIME IN AVALANCHE (ms)
Figure9. U n c l a m p e d I n d u c t i v e
Switching Capability
Figure10. Maximum Continuous Drain
Current vs Ambient Temperature
200
100
2000
SINGLE PULSE
RθJA = 125 oC/W
1000
100
10
A = 25 oC
100 μs
T
10
1
1 ms
THIS AREA IS
LIMITED BY r
DS(on)
10 ms
100 ms
SINGLE PULSE
TJ = MAX RATED
0.1
0.01
1 s
R
θJA = 125 oC/W
10 s
DC
T
A = 25 oC
1
0.5
10-4
10-3
10-2
t, PULSE WIDTH (sec)
10-1
1
10
100 1000
0.01
0.1
1
10
100 300
VDS, DRAIN to SOURCE VOLTAGE (V)
Figure 11. Forward Bias Safe
Operating Area
Figure 12. Single Pulse Maximum
Power Dissipation
©2012 Fairchild Semiconductor Corporation
FDS86540 Rev. C
4
www.fairchildsemi.com