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FDS6675BZ_08 PDF预览

FDS6675BZ_08

更新时间: 2024-11-12 04:18:39
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
6页 458K
描述
P-Channel PowerTrench㈢ MOSFET

FDS6675BZ_08 数据手册

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July 2008  
FDS6675BZ  
P-Channel PowerTrench® MOSFET  
tm  
-30V, -11A, 13mΩ  
General Description  
Features  
„ Max rDS(on) =13mat VGS = -10V, ID = -11A  
„ Max rDS(on) =21.8mat VGS = -4.5V, ID = -9A  
„ Extended VGS range (-25V) for battery applications  
„ HBM ESD protection level of 5.4 KV typical (note 3)  
This P-Channel MOSFET is producted using Fairchild  
Semiconductor’s advanced PowerTrench process that has  
been especially tailored to minimize the on-state  
resistance.  
This device is well suited for Power Management and load  
switching applications common in Notebook Computers  
and Portable Battery Packs.  
„ High performance trench technology for extremely low  
rDS(on)  
„ High power and current handing capability  
„ RoHS Compliant  
D
D
D
5
6
7
8
4
3
2
1
D
G
S
S
SO-8  
S
MOSFET Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
-30  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current -Continuous  
-Pulsed  
V
V
±25  
(Note 1a)  
-11  
ID  
A
-55  
Power Dissipation for Single Operation  
(Note 1a)  
(Note 1b)  
(Note 1c)  
2.5  
PD  
1.2  
W
1.0  
TJ, TSTG  
Operating and Storage Temperature  
-55 to 150  
°C  
Thermal Characteristics  
RθJA  
RθJC  
Thermal Resistance , Junction to Ambient (Note 1a)  
Thermal Resistance , Junction to Case (Note 1)  
50  
25  
°C/W  
°C/W  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape Width  
Quantity  
FDS6675BZ  
FDS6675BZ  
13’’  
12mm  
2500 units  
©2008 Fairchild Semiconductor Corporation  
FDS6675BZ Rev. B1  
1
www.fairchildsemi.com  

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