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FDS6675F011 PDF预览

FDS6675F011

更新时间: 2024-11-12 14:50:15
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 开关光电二极管晶体管
页数 文件大小 规格书
8页 247K
描述
Small Signal Field-Effect Transistor, 11A I(D), 30V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, SOIC-8

FDS6675F011 技术参数

生命周期:Obsolete零件包装代码:SOT
包装说明:SMALL OUTLINE, R-PDSO-G8针数:8
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.31配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):11 A
最大漏源导通电阻:0.014 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G8元件数量:1
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:P-CHANNEL认证状态:Not Qualified
表面贴装:YES端子形式:GULL WING
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDS6675F011 数据手册

 浏览型号FDS6675F011的Datasheet PDF文件第2页浏览型号FDS6675F011的Datasheet PDF文件第3页浏览型号FDS6675F011的Datasheet PDF文件第4页浏览型号FDS6675F011的Datasheet PDF文件第5页浏览型号FDS6675F011的Datasheet PDF文件第6页浏览型号FDS6675F011的Datasheet PDF文件第7页 
October 1998  
FDS6675  
Single P-Channel, Logic Level, PowerTrenchTM MOSFET  
General Description  
Features  
This P-Channel Logic Level MOSFET is produced  
using Fairchild Semiconductor's advanced PowerTrench  
process that has been especially tailored to minimize  
the on-state resistance and yet maintain low gate charge  
for superior switching performance.  
-11 A, -30 V. RDS(ON) = 0.014 W @ VGS = -10 V,  
RDS(ON) = 0.020 W @ VGS = -4.5 V.  
Low gate charge (30nC typical).  
High performance trench technology for extremely low  
RDS(ON)  
.
These devices are well suited for notebook computer  
applications: load switching and power management,  
battery charging circuits, and DC/DC conversion.  
High power and current handling capability.  
SuperSOTTM-6  
SO-8  
SOT-223  
SuperSOTTM-8  
SOIC-16  
SOT-23  
D
D
5
6
7
8
4
D
3
2
1
D
G
S
1
S
pin  
SO-8  
S
Absolute Maximum Ratings  
TA = 25oC unless otherwise noted  
Symbol  
VDSS  
VGSS  
ID  
Parameter  
FDS6675  
Units  
V
Drain-Source Voltage  
Gate-Source Voltage  
Drain Current - Continuous  
- Pulsed  
-30  
±20  
V
(Note 1a)  
-11  
A
-50  
PD  
Power Dissipation for Single Operation  
(Note 1a)  
2.5  
W
(Note 1b)  
(Note 1c)  
1.2  
1
TJ,TSTG  
Operating and Storage Temperature Range  
-55 to 150  
°C  
THERMAL CHARACTERISTICS  
RqJA  
RqJC  
Thermal Resistance, Junction-to-Ambient (Note 1a)  
Thermal Resistance, Junction-to-Case  
50  
25  
°C/W  
°C/W  
(Note 1)  
FDS6675 Rev.C1  
© 1998 Fairchild Semiconductor Corporation  

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