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FDMS10C4D2N PDF预览

FDMS10C4D2N

更新时间: 2023-09-03 20:36:52
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 410K
描述
N 沟道屏蔽门极 PowerTrench® MOSFET 100V,124A,4.2mΩ

FDMS10C4D2N 数据手册

 浏览型号FDMS10C4D2N的Datasheet PDF文件第1页浏览型号FDMS10C4D2N的Datasheet PDF文件第2页浏览型号FDMS10C4D2N的Datasheet PDF文件第4页浏览型号FDMS10C4D2N的Datasheet PDF文件第5页浏览型号FDMS10C4D2N的Datasheet PDF文件第6页浏览型号FDMS10C4D2N的Datasheet PDF文件第7页 
Electrical Characteristics TJ = 25 °C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
ID = 250 μA, VGS = 0 V  
100  
V
ΔBVDSS  
ΔTJ  
Breakdown Voltage Temperature  
Coefficient  
I
D = 250 μA, referenced to 25 °C  
60  
mV/°C  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
VDS = 80 V, VGS = 0 V  
VGS = ±20 V, VDS = 0 V  
1
μA  
100  
nA  
On Characteristics  
VGS(th)  
Gate to Source Threshold Voltage  
VGS = VDS, ID = 250 μA  
2.0  
3.1  
-9  
4.0  
V
ΔVGS(th)  
ΔTJ  
Gate to Source Threshold Voltage  
Temperature Coefficient  
I
D = 250 μA, referenced to 25 °C  
mV/°C  
V
GS = 10 V, ID = 44 A  
3.3  
5.3  
5.7  
116  
4.2  
14  
rDS(on)  
gFS  
Static Drain to Source On Resistance  
Forward Transconductance  
VGS = 6 V, ID = 22 A  
mΩ  
VGS = 10 V, ID = 44 A, TJ = 125 °C  
VDS = 10 V, ID = 44 A  
9.0  
S
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
2945  
1730  
20  
4500  
2600  
50  
pF  
pF  
pF  
Ω
VDS = 50 V, VGS = 0 V,  
f = 1 MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
0.1  
1.3  
2.6  
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
17  
9
31  
18  
40  
12  
65  
43  
ns  
ns  
VDD = 50 V, ID = 44 A,  
V
GS = 10 V, RGEN = 6 Ω  
Turn-Off Delay Time  
Fall Time  
25  
6
ns  
ns  
Qg  
Total Gate Charge  
Total Gate Charge  
Gate to Source Charge  
Gate to Drain “Miller” Charge  
VGS = 0 V to 10 V  
VGS = 0 V to 6 V  
42  
27  
13  
9.3  
nC  
nC  
nC  
nC  
Qg  
VDD = 50 V,  
D = 44 A  
I
Qgs  
Qgd  
Drain-Source Diode Characteristics  
V
GS = 0 V, IS = 2.1 A  
(Note 2)  
(Note 2)  
0.7  
0.8  
32  
1.2  
1.3  
52  
VSD  
Source to Drain Diode Forward Voltage  
V
VGS = 0 V, IS = 44 A  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
nC  
ns  
IF = 20 A, di/dt = 300 A/μs  
IF = 20 A, di/dt = 1000 A/μs  
Qrr  
trr  
57  
92  
25  
40  
Qrr  
158  
253  
nC  
Notes:  
2
1. R  
is determined with the device mounted on a 1 in pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R  
is determined by the user's board design.  
θJA  
θCA  
a)  
50 °C/W when mounted on a  
1 in pad of 2 oz copper  
b) 125 °C/W when mounted on a  
minimum pad of 2 oz copper.  
2
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.  
3. E of 337 mJ is based on starting T = 25 °C; N-ch: L = 3 mH, I = 15 A, V = 100 V, V =10 V. 100% test at L = 0.1 mH, I = 49 A.  
AS  
J
AS  
DD  
GS  
AS  
4. Pulsed Id please refer to Fig 11 SOA graph for more details.  
5. Computed continuous current limited to Max Junction Temperature only, actual continuous current will be limited by thermal & electro-mechanical application board design.  
©2016 Fairchild Semiconductor Corporation  
FDMS10C4D2N Rev. 1.0  
2
www.fairchildsemi.com  

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