Electrical Characteristics TJ = 25 °C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 250 μA, VGS = 0 V
100
V
ΔBVDSS
ΔTJ
Breakdown Voltage Temperature
Coefficient
I
D = 250 μA, referenced to 25 °C
60
mV/°C
IDSS
IGSS
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
VDS = 80 V, VGS = 0 V
VGS = ±20 V, VDS = 0 V
1
μA
100
nA
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = 250 μA
2.0
3.1
-9
4.0
V
ΔVGS(th)
ΔTJ
Gate to Source Threshold Voltage
Temperature Coefficient
I
D = 250 μA, referenced to 25 °C
mV/°C
V
GS = 10 V, ID = 44 A
3.3
5.3
5.7
116
4.2
14
rDS(on)
gFS
Static Drain to Source On Resistance
Forward Transconductance
VGS = 6 V, ID = 22 A
mΩ
VGS = 10 V, ID = 44 A, TJ = 125 °C
VDS = 10 V, ID = 44 A
9.0
S
Dynamic Characteristics
Ciss
Coss
Crss
Rg
Input Capacitance
2945
1730
20
4500
2600
50
pF
pF
pF
Ω
VDS = 50 V, VGS = 0 V,
f = 1 MHz
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
0.1
1.3
2.6
Switching Characteristics
td(on)
tr
td(off)
tf
Turn-On Delay Time
Rise Time
17
9
31
18
40
12
65
43
ns
ns
VDD = 50 V, ID = 44 A,
V
GS = 10 V, RGEN = 6 Ω
Turn-Off Delay Time
Fall Time
25
6
ns
ns
Qg
Total Gate Charge
Total Gate Charge
Gate to Source Charge
Gate to Drain “Miller” Charge
VGS = 0 V to 10 V
VGS = 0 V to 6 V
42
27
13
9.3
nC
nC
nC
nC
Qg
VDD = 50 V,
D = 44 A
I
Qgs
Qgd
Drain-Source Diode Characteristics
V
GS = 0 V, IS = 2.1 A
(Note 2)
(Note 2)
0.7
0.8
32
1.2
1.3
52
VSD
Source to Drain Diode Forward Voltage
V
VGS = 0 V, IS = 44 A
trr
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Time
Reverse Recovery Charge
ns
nC
ns
IF = 20 A, di/dt = 300 A/μs
IF = 20 A, di/dt = 1000 A/μs
Qrr
trr
57
92
25
40
Qrr
158
253
nC
Notes:
2
1. R
is determined with the device mounted on a 1 in pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R
is determined by the user's board design.
θJA
θCA
a)
50 °C/W when mounted on a
1 in pad of 2 oz copper
b) 125 °C/W when mounted on a
minimum pad of 2 oz copper.
2
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. E of 337 mJ is based on starting T = 25 °C; N-ch: L = 3 mH, I = 15 A, V = 100 V, V =10 V. 100% test at L = 0.1 mH, I = 49 A.
AS
J
AS
DD
GS
AS
4. Pulsed Id please refer to Fig 11 SOA graph for more details.
5. Computed continuous current limited to Max Junction Temperature only, actual continuous current will be limited by thermal & electro-mechanical application board design.
©2016 Fairchild Semiconductor Corporation
FDMS10C4D2N Rev. 1.0
2
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