March 2013
FCI25N60N_F102
N-Channel SupreMOS MOSFET
®
600 V, 25 A, 125 mΩ
Features
Description
®
®
•
•
•
•
•
RDS(on) = 107 mΩ (Typ.)@ VGS = 10 V, ID = 12.5 A
Ultra Low Gate Charge (Typ. Qg = 57 nC)
Low Effective Output Capacitance (Typ. Coss.eff = 262 pF)
100% Avalanche Tested
The SupreMOS MOSFET is Fairchild Semiconductor ’s next-
generation of high voltage super-junction (SJ) technology
employing a deep trench filling process that differentiate it from
the conventional MOSFETs. This advanced technology and pre-
cise process control provide lowest Rsp on-resistance, superior
switching performance and ruggedness. SupreMOS MOSFET is
suitable for high frequency switching power converter applica-
tions such as PFC, server/telecom power, FPD TV power, ATX
power and industrial power applications.
RoHS Compliant
Applications
•
Solar Inverter
•
AC-DC Power Supply
D
G
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*
Symbol
VDSS
VGSS
Parameter
FCI25N60N_F102
Unit
V
Drain to Source Voltage
Gate to Source Voltage
600
±30
V
Continuous (TC = 25oC)
Continuous (TC = 100oC)
Pulsed
25
ID
Drain Current
A
16
IDM
EAS
IAR
Drain Current
(Note 1)
(Note 2)
75
A
mJ
A
Single Pulsed Avalanche Energy
Avalanche Current
861
8.3
EAR
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
MOSFET dv/dt
2.2
mJ
(Note 3)
15
dv/dt
PD
V/ns
100
(TC = 25oC)
Derate above 25oC
216
W
W/oC
oC
Power Dissipation
1.72
-55 to +150
TJ, TSTG
TL
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
300
oC
*Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
Parameter
Thermal Resistance, Junction to Case
FCI25N60N_F102
Unit
RθJC
RθCS
RθJA
0.58
0.5
Thermal Resistance, Case to Heat Sink (Typical)
Thermal Resistance, Junction to Ambient
oC/W
62.5
©2010 Fairchild Semiconductor Corporation
FCI25N60N_F102 Rev. C0
1
www.fairchildsemi.com