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FCI25N60NF102 PDF预览

FCI25N60NF102

更新时间: 2024-09-18 12:04:07
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飞兆/仙童 - FAIRCHILD /
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8页 364K
描述
N-Channel SupreMOS® MOSFET 600 V, 25 A, 125 mΩ

FCI25N60NF102 数据手册

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March 2013  
FCI25N60N_F102  
N-Channel SupreMOS MOSFET  
®
600 V, 25 A, 125 mΩ  
Features  
Description  
®
®
RDS(on) = 107 mΩ (Typ.)@ VGS = 10 V, ID = 12.5 A  
Ultra Low Gate Charge (Typ. Qg = 57 nC)  
Low Effective Output Capacitance (Typ. Coss.eff = 262 pF)  
100% Avalanche Tested  
The SupreMOS MOSFET is Fairchild Semiconductor ’s next-  
generation of high voltage super-junction (SJ) technology  
employing a deep trench filling process that differentiate it from  
the conventional MOSFETs. This advanced technology and pre-  
cise process control provide lowest Rsp on-resistance, superior  
switching performance and ruggedness. SupreMOS MOSFET is  
suitable for high frequency switching power converter applica-  
tions such as PFC, server/telecom power, FPD TV power, ATX  
power and industrial power applications.  
RoHS Compliant  
Applications  
Solar Inverter  
AC-DC Power Supply  
D
G
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*  
Symbol  
VDSS  
VGSS  
Parameter  
FCI25N60N_F102  
Unit  
V
Drain to Source Voltage  
Gate to Source Voltage  
600  
±30  
V
Continuous (TC = 25oC)  
Continuous (TC = 100oC)  
Pulsed  
25  
ID  
Drain Current  
A
16  
IDM  
EAS  
IAR  
Drain Current  
(Note 1)  
(Note 2)  
75  
A
mJ  
A
Single Pulsed Avalanche Energy  
Avalanche Current  
861  
8.3  
EAR  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
MOSFET dv/dt  
2.2  
mJ  
(Note 3)  
15  
dv/dt  
PD  
V/ns  
100  
(TC = 25oC)  
Derate above 25oC  
216  
W
W/oC  
oC  
Power Dissipation  
1.72  
-55 to +150  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
300  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
FCI25N60N_F102  
Unit  
RθJC  
RθCS  
RθJA  
0.58  
0.5  
Thermal Resistance, Case to Heat Sink (Typical)  
Thermal Resistance, Junction to Ambient  
oC/W  
62.5  
©2010 Fairchild Semiconductor Corporation  
FCI25N60N_F102 Rev. C0  
1
www.fairchildsemi.com  

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